Validation of Approaches (Salt Formation & Introduction of Amino Group/s) for Imparting/Improving Thermal Stability of Explosives, Part I

2021 ◽  
Author(s):  
Jai Prakash Agrawal ◽  
Vishal Suresh Dodke
Keyword(s):  
Thermal Stability ◽  
Amino Group ◽  
Salt Formation ◽  
Thermal Stability Of

Synthesis and Thermal Stability of New Polynitrostilbenes

2015 ◽  
Vol 68 (6) ◽  
pp. 919 ◽  
Author(s):  
Jianping Wei ◽  
Fangmei Li ◽  
Junhui Xu ◽  
Xinhua Peng
Keyword(s):  
Thermal Stability ◽  
Differential Scanning Calorimetry ◽  
Knoevenagel Condensation ◽  
Aromatic Aldehydes ◽  
Amino Group ◽  
Double Bonds ◽  
Scanning Calorimetry ◽  
Thermal Stability Of

New polynitrostilbenes were directly synthesised by the Knoevenagel condensation of aromatic aldehydes with nitrotoluenes. The differential scanning calorimetry results demonstrated that the introduction of an amino group and C=C double bonds could improve the thermal stability.

Effect of the Terminal Amino Group of a Linker Arm and Its Length at the C5 Position of a Pyrimidine Nucleoside on the Thermal Stability of DNA Duplexes

2001 ◽  
Vol 29 (4) ◽  
pp. 187-197 ◽  
Author(s):  
Hiroaki Ozaki ◽  
Masayuki Mine ◽  
Yoshinori Ogawa ◽  
Hiroaki Sawai
Keyword(s):  
Thermal Stability ◽  
Amino Group ◽  
Dna Duplexes ◽  
Pyrimidine Nucleoside ◽  
Terminal Amino ◽  
Thermal Stability Of

Energetic propane-1,3-diaminium and butane-1,4-diaminium salts of N,N′-dinitroethylenediazanide: syntheses, crystal structures and thermal properties

2019 ◽  
Vol 75 (1) ◽  
pp. 54-60
Author(s):  
Gerhard T. Roodt ◽  
Bhawna Uprety ◽  
Demetrius C. Levendis ◽  
Charmaine Arderne
Keyword(s):  
Thermal Stability ◽  
Thermal Decomposition ◽  
Hydrogen Bonding ◽  
Thermal Properties ◽  
Monoclinic Space Group ◽  
Salt Formation ◽  
Orthorhombic Space Group ◽  
Space Group ◽  
Hydrogen Bonding Networks ◽  
Thermal Stability Of

The acidity of the amine H atoms and the consequent salt formation ability of ethylenedinitramine (EDNA) were analyzed in an attempt to improve the thermal stability of EDNA. Two short-chain alkanediamine bases, namely propane-1,3-diamine and butane-1,4-diamine, were chosen for this purpose. The resulting salts, namely propane-1,3-diaminium N,N′-dinitroethylenediazanide, C3H12N2 2+·C2H4N4O4 2−, and butane-1,4-diaminium N,N′-dinitroethylenediazanide, C4H14N2 2+·C2H4N4O4 2−, crystallize in the orthorhombic space group Pbca and the monoclinic space group P21/n, respectively. The resulting salts display extensive hydrogen-bonding networks because of the presence of ammonium and diazenide ions in the crystal lattice. This results in an enhanced thermal stability and raises the thermal decomposition temperatures to 202 and 221 °C compared to 180 °C for EDNA. The extensive hydrogen bonding present also plays a crucial role in lowering the sensitivity to impact of these energetic salts.

The Ordered Phase Formation in Ti-Al-Ga Alloys

1970 ◽  
Vol 28 ◽  
pp. 440-441
Author(s):  
Shiro Fujishiro ◽  
Harold L. Gegel
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Titanium Alloys ◽  
Growth Kinetics ◽  
Stoichiometric Composition ◽  
Good Potential ◽  
Alpha Titanium ◽  
Cold Rolled ◽  
Kinetics Of ◽  
Thermal Stability Of

Ordered-alpha titanium alloys having a DO19 type structure have good potential for high temperature (600°C) applications, due to the thermal stability of the ordered phase and the inherent resistance to recrystallization of these alloys. Five different Ti-Al-Ga alloys consisting of equal atomic percents of aluminum and gallium solute additions up to the stoichiometric composition, Ti3(Al, Ga), were used to study the growth kinetics of the ordered phase and the nature of its interface.The alloys were homogenized in the beta region in a vacuum of about 5×10-7 torr, furnace cooled; reheated in air to 50°C below the alpha transus for hot working. The alloys were subsequently acid cleaned, annealed in vacuo, and cold rolled to about. 050 inch prior to additional homogenization

Microstructure studies of tungsten silicide schottky contacts on Gaas

1987 ◽  
Vol 45 ◽  
pp. 328-329
Author(s):  
Yih-Cheng Shih ◽  
E. L. Wilkie
Keyword(s):  
Thermal Stability ◽  
Field Effect Transistors ◽  
Schottky Contact ◽  
Schottky Contacts ◽  
Excellent Thermal Stability ◽  
Barrier Heights ◽  
Gaas Substrates ◽  
Film Adhesion ◽  
Threshold Voltages ◽  
Thermal Stability Of

Tungsten silicides (WSix) have been successfully used as the gate materials in self-aligned GaAs metal-semiconductor-field- effect transistors (MESFET). Thermal stability of the WSix/GaAs Schottky contact is of major concern since the n+ implanted source/drain regions must be annealed at high temperatures (∼ 800°C). WSi0.6 was considered the best composition to achieve good device performance due to its low stress and excellent thermal stability of the WSix/GaAs interface. The film adhesion and the uniformity in barrier heights and ideality factors of the WSi0.6 films have been improved by depositing a thin layer of pure W as the first layer on GaAs prior to WSi0.6 deposition. Recently WSi0.1 has been used successfully as the gate material in 1x10 μm GaAs FET's on the GaAs substrates which were sputter-cleaned prior to deposition. These GaAs FET's exhibited uniform threshold voltages across a 51 mm wafer with good film adhesion after annealing at 800°C for 10 min.

Thermal stability of Al-Cu-Fe icosahedral alloys

1991 ◽  
Vol 1 (12) ◽  
pp. 1823-1836 ◽  
Author(s):  
M. Bessière ◽  
A. Quivy ◽  
S. Lefebvre ◽  
J. Devaud-Rzepski ◽  
Y. Calvayrac
Keyword(s):  
Thermal Stability ◽  
Thermal Stability Of

Practical criteria for the thermal stability of a unidimensional superconductor

1994 ◽  
Vol 4 (4) ◽  
pp. 653-657
Author(s):  
B. Bonzi ◽  
M. El Khomssi ◽  
H. Lanchon-Ducauquis
Keyword(s):  
Thermal Stability ◽  
Thermal Stability Of

Time and thermal stability of magnetic properties of amorphous Fe80TM3B17 alloys

1998 ◽  
Vol 08 (PR2) ◽  
pp. Pr2-63-Pr2-66 ◽  
Author(s):  
R. Varga ◽  
P. Vojtaník ◽  
A. Lovas
Keyword(s):  
Thermal Stability ◽  
Magnetic Properties ◽  
Thermal Stability Of

Thermal stability of tunnel junctions with additional oxidation at the surface of the bottom electrode.

2003 ◽  
Vol 27 (4) ◽  
pp. 303-306 ◽  
Author(s):  
S. Iura ◽  
H. Kubota ◽  
Y. Ando ◽  
T. Miyazaki
Keyword(s):  
Thermal Stability ◽  
Bottom Electrode ◽  
Tunnel Junctions ◽  
Thermal Stability Of

Thermal stability of organic-inorganic nanocomposites based on system of dimethacrylate-tetraethoxysilane and their kinetic features

2016 ◽  
Vol 38 (3) ◽  
pp. 211-217
Author(s):  
G.I. Khovanets’ ◽  
◽  
O.Y. Makido ◽  
V.V. Kochubey ◽  
Y.G. Medvedevskikh ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Inorganic Nanocomposites ◽  
Thermal Stability Of ◽  
Kinetic Features
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