scholarly journals Spatiotemporally Resolved Heat Dissipation in 3D Patterned Magnetically Responsive Hydrogels

Small ◽  
2020 ◽  
pp. 2004452
Author(s):  
Patricia Monks ◽  
Jacek K. Wychowaniec ◽  
Eoin McKiernan ◽  
Shane Clerkin ◽  
John Crean ◽  
...  
Keyword(s):  
Heat Dissipation ◽  
Responsive Hydrogels

scholarly journals Magnetic Hydrogels: Spatiotemporally Resolved Heat Dissipation in 3D Patterned Magnetically Responsive Hydrogels (Small 5/2021)

Small ◽  
2021 ◽  
Vol 17 (5) ◽  
pp. 2170018
Author(s):  
Patricia Monks ◽  
Jacek K. Wychowaniec ◽  
Eoin McKiernan ◽  
Shane Clerkin ◽  
John Crean ◽  
...  
Keyword(s):  
Heat Dissipation ◽  
Responsive Hydrogels

Integration of pure copper to optimize heat dissipation in injection mould inserts using laser metal deposition

2021 ◽  
Vol 33 (1) ◽  
pp. 012029
Author(s):  
Stefan Polenz ◽  
Christian Kolbe ◽  
Florian Bittner ◽  
Elena López ◽  
Frank Brückner ◽  
...  
Keyword(s):  
Heat Dissipation ◽  
Pure Copper ◽  
Metal Deposition ◽  
Laser Metal Deposition ◽  
Injection Mould

3D Integrated Power—A Discrete Perspective

2015 ◽  
Author(s):  
Ian Kearney ◽  
Stephen Brink
Keyword(s):  
Heat Dissipation ◽  
Automatic Test Equipment ◽  
Systematic Analysis ◽  
Power Mosfet ◽  
Root Cause ◽  
Industry Standard ◽  
Bona Fide ◽  
Process Issue ◽  
Board Level ◽  
3D Package

Abstract The shift in power conversion and power management applications to thick copper clip technologies and thinner silicon dies enable high-current connections (overcoming limitations of common wire bond) and enhance the heat dissipation properties of System-in-Package solutions. Powerstage innovation integrates enhanced gate drivers with two MOSFETs combining vertical current flow with a lateral power MOSFET. It provides a low on-resistance and requires an extremely low gate charge with industry-standard package outlines - a combination not previously possible with existing silicon platforms. These advancements in both silicon and 3D Multi-Chip- Module packaging complexity present multifaceted challenges to the failure analyst. The various height levels and assembly interfaces can be difficult to deprocess while maintaining all the critical evidence. Further complicating failure isolation within the system is the integration of multiple chips, which can lead to false positives. Most importantly, the discrete MOSFET all too often gets overlooked as just a simple threeterminal device leading to incorrect deductions in determining true root cause. This paper presents the discrete power MOSFET perspective amidst the competing forces of the system-to-board-level failure analysis. It underlines the requirement for diligent analysis at every step and the importance as an analyst to contest the conflicting assumptions of challenging customers. Automatic Test Equipment (ATE) data-logs reported elevated power MOSFET leakage. Initial assumptions believed a MOSFET silicon process issue existed. Through methodical anamnesis and systematic analysis, the true failure was correctly isolated and the power MOSFET vindicated. The authors emphasize the importance of investigating all available evidence, from a macro to micro 3D package perspective, to achieve the bona fide path forward and true root cause.

Effect of Plated Helix on Heat Dissipation Capability of the Slow-Wave Circuit

2011 ◽  
Vol 30 (8) ◽  
pp. 2029-2032
Author(s):  
Yong Han ◽  
Yan-wen Liu ◽  
Yao-gen Ding ◽  
Pu-kun Liu ◽  
Chun-hua Lu ◽  
...  
Keyword(s):  
Slow Wave ◽  
Heat Dissipation

DESIGN AND THERMAL ANALYSIS OF BRAKE ROTOR WITH DIFFERENT MATERIALS

2020 ◽  
Vol 15 (2) ◽  
Author(s):  
Sugunarani S ◽  
Santhosh V
Keyword(s):  
Temperature Distribution ◽  
Heat Dissipation ◽  
Brake Disc ◽  
Element Analysis ◽  
Analysis Techniques ◽  
Engineering Software ◽  
The Finite Element Analysis ◽  
Brake Rotor ◽  
Grey Cast ◽  
Aluminium Metal

This work deals with the analysis of heat generation and dissipation in the disc brake of a car during braking and the following release period by using computer-aided engineering software for three different materials of the rotor disc and brake pad. The objective of this work is to analyze the temperature distribution of rotor disc during operation using COMSOL Multiphysics. The work uses the finite element analysis techniques to calculate and predict the temperature distribution on the brake disc and to identify the critical temperature of the brake rotor disc. Conduction, convection and radiation of heat transfer have been analyzed. The results obtained from the analysis indicates that different material on the same retardation of the car during braking shows different temperature distribution. A comparative study was made between grey cast iron (GCI), Aluminium Metal Matrix Composite (AMMC), Alloy steel materials are used for brake disc and the best material for making brake disc based on the rate of heat dissipation have been suggested.

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