Honeywell Aerospace, along with Applied Physics Systems, Sunnyvale, CA, has developed 300°C capable directional sensor technology in support of the U.S. Department of Energy's Enhanced Geothermal Technologies initiative. The development has culminated in fabrication of custom silicon-on-insulator IC's, fabrication and assembly of ceramic hybrid electronics, and the directional sensors, accelerometers and flux-gate magnetometers, all capable of operating at temperatures up to 300°C. The sensors and supporting hybrid electronics have been integrated into a non-magnetic chassis designed for inclusion in a directional drilling bottom-hole assembly. This paper presents the technology approach, material selection decisions, processing techniques, final sensor and electronics configuration, and initial testing of the integrated directional module.