Nanomechanical Characterization of Lead Free Solder Joints

2013 ◽  
pp. 11-22 ◽  
Author(s):  
Md Hasnine ◽  
Muhannad Mustafa ◽  
Jeffrey C. Suhling ◽  
Barton C. Prorok ◽  
Michael J. Bozack ◽  
...  
Keyword(s):  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Characterization of aging effects in lead free solder joints using nanoindentation

2013 ◽  
Author(s):  
Mohammad Hasnine ◽  
Muhannad Mustafa ◽  
Jeffrey C. Suhling ◽  
Barton C. Prorok ◽  
Michael J. Bozack ◽  
...  
Keyword(s):  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Aging Effects ◽  
Free Solder

Characterization of Recrystallization and Microstructure Evolution in Lead-Free Solder Joints Using EBSD and 3D-XRD

2012 ◽  
Vol 42 (2) ◽  
pp. 319-331 ◽  
Author(s):  
Bite Zhou ◽  
Thomas R. Bieler ◽  
Tae-Kyu Lee ◽  
Wenjun Liu
Keyword(s):  
Microstructure Evolution ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Intermetallics Characterization of Lead-Free Solder Joints under Isothermal Aging

2008 ◽  
Vol 37 (8) ◽  
pp. 1130-1138 ◽  
Author(s):  
Anupam Choubey ◽  
Hao Yu ◽  
Michael Osterman ◽  
Michael Pecht ◽  
Fu Yun ◽  
...  
Keyword(s):  
Isothermal Aging ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Research on Microstructure and Shear Behavior of Au/Sn-Ag-Cu/Cu Lead-free Solder Joints at Different Soldering Temperatures

2021 ◽  
Author(s):  
Xinmeng Zhai ◽  
Yue Chen ◽  
Yuefeng Li ◽  
Jun Zou ◽  
Mingming Shi ◽  
...  
Keyword(s):  
Solder Joints ◽  
Shear Behavior ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Electromigration Induced Stress in Lead-Free Solder Joints

2016 ◽  
Author(s):  
Jiamin Ni ◽  
Antoinette Maniatty ◽  
Yong Liu ◽  
Jifa Hao ◽  
Matt Ring
Keyword(s):  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Induced Stress ◽  
Free Solder

Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates

2017 ◽  
Vol 66 (4) ◽  
pp. 1229-1237 ◽  
Author(s):  
P. Wild ◽  
T. Grozinger ◽  
D. Lorenz ◽  
A. Zimmermann
Keyword(s):  
Solder Joints ◽  
Void Formation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Quantitative Evaluation of Voids in Lead Free Solder Joints

2015 ◽  
Vol 772 ◽  
pp. 284-289 ◽  
Author(s):  
Sabuj Mallik ◽  
Jude Njoku ◽  
Gabriel Takyi
Keyword(s):  
Solder Bump ◽  
Solder Joints ◽  
Void Formation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
X Ray ◽  
Size And Shape ◽  
Solder Bumps ◽  
Free Solder

Voiding in solder joints poses a serious reliability concern for electronic products. The aim of this research was to quantify the void formation in lead-free solder joints through X-ray inspections. Experiments were designed to investigate how void formation is affected by solder bump size and shape, differences in reflow time and temperature, and differences in solder paste formulation. Four different lead-free solder paste samples were used to produce solder bumps on a number of test boards, using surface mount reflow soldering process. Using an advanced X-ray inspection system void percentages were measured for three different size and shape solder bumps. Results indicate that the voiding in solder joint is strongly influenced by solder bump size and shape, with voids found to have increased when bump size decreased. A longer soaking period during reflow stage has negatively affectedsolder voids. Voiding was also accelerated with smaller solder particles in solder paste.

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