Driving Point FRF Fixture Evaluation for Shock Testing

2017 ◽  
pp. 251-257
Author(s):  
David E. Soine ◽  
Richard J. Jones
Keyword(s):  
Shock Testing

Structure Evolution of 7YSZ Thermal Barrier Coating During Thermal Shock Testing

2015 ◽  
Vol 30 (12) ◽  
pp. 1261
Author(s):  
ZHANG Xiao-Feng ◽  
ZHOU Ke-Song ◽  
ZHANG Ji-Fu ◽  
ZHANG Yong ◽  
LIU Min ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Thermal Barrier Coating ◽  
Structure Evolution ◽  
Thermal Barrier ◽  
Shock Testing ◽  
Barrier Coating

scholarly journals Fingerprinting shock-induced deformations via diffraction

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Avanish Mishra ◽  
Cody Kunka ◽  
Marco J. Echeverria ◽  
Rémi Dingreville ◽  
Avinash M. Dongare
Keyword(s):  
High Speed ◽  
Shock Loading ◽  
Dislocation Slip ◽  
Line Profiles ◽  
X Ray Diffraction ◽  
Final State ◽  
X Ray ◽  
Shock Testing ◽  
Local Pressures ◽  
Deformation Modes

AbstractDuring the various stages of shock loading, many transient modes of deformation can activate and deactivate to affect the final state of a material. In order to fundamentally understand and optimize a shock response, researchers seek the ability to probe these modes in real-time and measure the microstructural evolutions with nanoscale resolution. Neither post-mortem analysis on recovered samples nor continuum-based methods during shock testing meet both requirements. High-speed diffraction offers a solution, but the interpretation of diffractograms suffers numerous debates and uncertainties. By atomistically simulating the shock, X-ray diffraction, and electron diffraction of three representative BCC and FCC metallic systems, we systematically isolated the characteristic fingerprints of salient deformation modes, such as dislocation slip (stacking faults), deformation twinning, and phase transformation as observed in experimental diffractograms. This study demonstrates how to use simulated diffractograms to connect the contributions from concurrent deformation modes to the evolutions of both 1D line profiles and 2D patterns for diffractograms from single crystals. Harnessing these fingerprints alongside information on local pressures and plasticity contributions facilitate the interpretation of shock experiments with cutting-edge resolution in both space and time.

scholarly journals Shock Pulse Shaping in a Small-Form Factor Velocity Amplifier

2010 ◽  
Vol 17 (6) ◽  
pp. 787-802 ◽  
Author(s):  
Gerard Kelly ◽  
Jeff Punch ◽  
Suresh Goyal ◽  
Michael Sheehy
Keyword(s):  
Pulse Shaping ◽  
Vertical Axis ◽  
Mechanical Shock ◽  
Practical Applications ◽  
Shock Testing ◽  
Acceleration Signal ◽  
High Acceleration ◽  
Component Assembly ◽  
Small Form Factor ◽  
Shock Pulses

This theme of this paper is the design and characterisation of a velocity amplifier (VAMP) machine for high-acceleration shock testing of micro-scale devices. The VAMP applies multiple sequential impacts to amplify velocity through a system of three progressively smaller masses constrained to move in the vertical axis. Repeatable, controlled, mechanical shock pulses are created through the metal-on-metal impact between pulse shaping test rods, which form part of the penultimate and ultimate masses. The objectives are to investigate the controllable parameters that affect the shock pulses induced on collision, namely; striker and incident test rod material; test rod length; pulse shaping mechanisms; and impact velocity. The optimum VAMP configuration was established as a 60 mm long titanium striker test rod and a 120 mm long titanium incident rod. This configuration exhibited an acceleration magnitude and a primary pulse duration range of 5,800–23,400 g and 28.0–44.0μs respectively. It was illustrated that the acceleration spectral content can be manipulated through control of the test rod material and length. This is critical in the context of practical applications, where it is postulated that the acceleration signal can be controlled to effectively excite specific components in a multi-component assembly affixed to the VAMP incident test rod.

281. An evaluation of the critical pv-values of carbons for a mechanical seal by thermal shock testing

Carbon ◽  
1982 ◽  
Vol 20 (2) ◽  
pp. 156
Author(s):  
S. Sato ◽  
K. Kawamata ◽  
J. Aizawa ◽  
M. Ishii
Keyword(s):  
Thermal Shock ◽  
Mechanical Seal ◽  
Shock Testing

Board-Level Reliability of Pb-Free Surface Mounted Assemblies during Thermal Shock Testing

2006 ◽  
Vol 15-17 ◽  
pp. 633-638 ◽  
Author(s):  
Jong Woong Kim ◽  
Hyun Suk Chun ◽  
Sang Su Ha ◽  
Jong Hyuck Chae ◽  
Jin Ho Joo ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Solder Joints ◽  
Lead Frame ◽  
Shear Forces ◽  
Microstructural Investigation ◽  
Shock Testing ◽  
Ceramic Capacitor ◽  
Board Level ◽  
Board Level Reliability ◽  
Thermal Shocks

Board-level reliability of conventional Sn-37Pb and Pb-free Sn-3.0Ag-0.5Cu solder joints was evaluated using thermal shock testing. In the microstructural investigation of the solder joints, the formation of Cu6Sn5 intermetallic compound (IMC) layer was observed between both solders and Cu lead frame, but any crack or newly introduced defect cannot be found even after 2000 cycles of thermal shocks. Shear test of the multi layer ceramic capacitor (MLCC) joints were also conducted to investigate the effect of microstructural variations on the bonding strength of the solder joints. Shear forces of the both solder joints decreased with increasing thermal shock cycles. The reason to the decrease in shear force was discussed with fracture surfaces of the shear tested solder joints.

151. Thermal shock testing using focused electron beam heating

Carbon ◽  
1969 ◽  
Vol 7 (6) ◽  
pp. 732
Author(s):  
R.D Reiswig ◽  
P.E Armstrong ◽  
L.S Levinson
Keyword(s):  
Electron Beam ◽  
Thermal Shock ◽  
Shock Testing ◽  
Beam Heating ◽  
Electron Beam Heating
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