Microwave Sintering

2018 ◽  
pp. 237-274 ◽  
Author(s):  
Eugene A. Olevsky ◽  
Dina V. Dudina
Keyword(s):  
2021 ◽  
Vol 10 ◽  
pp. 34-50
Author(s):  
G.R. Li ◽  
J.J. Chen ◽  
D. Zhang ◽  
H.M. Wang ◽  
M. Liu ◽  
...  

Materials ◽  
2021 ◽  
Vol 14 (2) ◽  
pp. 438
Author(s):  
Shuwei Yang ◽  
Bingliang Liang ◽  
Changhong Liu ◽  
Jin Liu ◽  
Caisheng Fang ◽  
...  

The (1–x)Ca0.61La0.26TiO3-xNd(Mg0.5Ti0.5)O3 [(1–x)CLT-xNMT, x = 0.35~0.60] ceramics were prepared via microwave sintering. The effects of sintering temperature and composition on the phase formation, microstructure, and microwave dielectric properties were investigated. The results show that the microwave sintering process requires a lower sintering temperature and shorter sintering time of (1–x)CLT-xNMT ceramics than conventional heating methods. All of the (1–x)CLT-xNMT ceramics possess a single perovskite structure. With the increase of x, the dielectric constant (ε) shows a downward trend; the quality factor (Qf) drops first and then rises significantly; the resonance frequency temperature coefficient (τf) keeps decreasing. With excellent microwave dielectric properties (ε = 51.3, Qf = 13,852 GHz, τf = −1.9 × 10−6/°C), the 0.65CLT-0.35NMT ceramic can be applied to the field of mobile communications.


Materials ◽  
2021 ◽  
Vol 14 (4) ◽  
pp. 776
Author(s):  
Nur Syahirah Mohamad Zaimi ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Andrei Victor Sandu ◽  
Mohd Mustafa Al Bakri Abdullah ◽  
Norainiza Saud ◽  
...  

This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.


2013 ◽  
Vol 39 (3) ◽  
pp. 3269-3277 ◽  
Author(s):  
Daniel Żymełka ◽  
Sébastien Saunier ◽  
Dominique Goeuriot ◽  
Jérôme Molimard

1990 ◽  
Vol 189 ◽  
Author(s):  
L. Skala ◽  
V.M. Kenkre ◽  
M.W. Weiser ◽  
J.D. Katz

ABSTRACTAs part of a program of investigation of microwave sintering, self-consistent CNDO/2 calculations are presented for diffusion barriers and potentials for the motion of interstitial atoms and vacancies in MgO. Clusters of 30 atoms are used in the calculations. Activation energies, diffusion barriers, shape of the potentials and electron densities are obtained.


Author(s):  
S.V. Egorov ◽  
A.G. Eremeev ◽  
V.V. Kholoptsev ◽  
I.V. Plotnikov ◽  
K.I. Rybakov ◽  
...  

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