Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications

Electronic manufacturing is one of the dynamic industries in the world in terms of leading technological advancements. Electronic assembly’s heart lies the ‘soldering technology’ and the ‘solder joints’ between electronic components and substrate. During the operation of electronic products, solder joints experience harsh environmental conditions in terms of cyclic change of temperature and vibration and exposure to moisture and chemicals. Due to the cyclic application of loads and higher operational temperature, solder joints fail primarily through creep and fatigue failures. This paper presents the creep-fatigue behaviours of solder joints in a ball grid array (BGA) soldered on a printed circuit board (PCB). Using finite element (FE) simulation, the solder joints were subjected to thermal cycling and isothermal ageing. Accelerated thermal cycling (ATC) was carried out using a temperate range from 40°C to 150°C, and isothermal ageing was done at −40, 25, 75 and 150°C temperatures for 45 days (64,800 mins). The solders studied are lead-based eutectic Sn63Pb37 and lead-free SAC305, SAC387, SAC396 and SAC405. The results were analysed using the failure criterion of equivalent stress, strain rate, deformation rate, and the solders’ strain energy density. The SAC405 and SAC396 have the least stress magnitude, strain rate, deformation rate, and strain energy density damage than the lead-based eutectic Sn63Pb37 solder; they have the highest fatigue lives based on the damage mechanisms. This research provides a technique for determining the preventive maintenance time of BGA components in mission-critical systems. Furthermore, it proposes developing a new life prediction model based on a combination of the damage parameters for improved prediction.

Phase Transformations upon Ageing in Ti15Mo Alloy Subjected to Two Different Deformation Methods

Ti15Mo alloy was subjected to two techniques of intensive plastic deformation, namely high pressure torsion and rotary swaging at room temperature. The imposed strain resulted in the formation of an ultrafine-grained structure in both deformed conditions. Detailed inspection of the microstructure revealed the presence of grains with a size of around 100 nm in both conditions. The microstructure after rotary swaging also contained elongated grains with a length up to 1 µm. Isothermal ageing at 400 °C and 500 °C up to 16 h was applied to both conditions to investigate the kinetics of precipitation of the α phase and the recovery of lattice defects. Positron annihilation spectroscopy indicated that the recovery of lattice defects in the β matrix had already occurred at 400 °C and, in terms of positron trapping, was partly compensated by the precipitation of incoherent α particles. At 500 °C the recovery was fully offset by the formation of incoherent α/β interfaces. Contrary to common coarse-grained material, in which the α phase precipitates in the form of lamellae, precipitation of small and equiaxed α particles occurred in the deformed condition. A refined two-phase equiaxed microstructure with α particles and β grain sizes below 1 μm is achievable by simple rotary swaging followed by ageing.

Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing

This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.

Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB)

Ball grid array (BGA) packages have increasing applications in mobile phones, disk drives, LC displays and automotive engine controllers. However, the thermo-mechanical reliability of the BGA solder joints challenges the device functionality amidst component and system miniaturisation as well as wider adoption of lead-free solders. This investigation determines the effective BGA solders for improved thermo-mechanical reliability of the devices. It utilised a conducted study on creep response of a lead-based eutectic Sn63Pb37 and four lead-free Tin–Silver–Copper (SnAgCu) [SAC305, SAC387, SAC396 and SAC405] solders subjected to thermal cycling loadings and isothermal ageing. The solders form the joints between the BGAs and printed circuit boards (PCBs). ANSYS R19.0 package is used to simulate isothermal ageing of some of the assemblies at − 40°C, 25°C, 75°C and 150°C for 45 days and model the thermal cycling history of the other assemblies from 22°C ambient temperature for six cycles. The response of the solders is simulated using the Garofalo-Arrhenius creep model. Under thermal ageing, SAC396 solder joints demonstrate possession of least strain energy density, deformation and von Mises stress in comparison to the other solders. Under thermal cycle loading conditions, SAC405 acquired the lowest amount of the damage parameters in comparison. Lead-free SAC405 and SAC387 joints accumulated the lowest and highest energy dissipation per cycle, respectively. It is concluded that SAC405 and SAC396 are the most effective solders for BGA in devices experiencing isothermal ageing and temperature cycling during operation, respectively. They are proposed as the suitable replacement of eutectic Sn63Pb37 solder for the various conditions.

Performance of 96.5Sn–3Ag–0.5Cu/fullerene composite solder under isothermal ageing and high-current stressing

Purpose The purpose of this paper is to investigate the effect of fullerene (FNS) reinforcements on the microstructure and mechanical properties of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder joints under isothermal ageing and electrical-migration (EM) stressing. Design/methodology/approach In this paper, SAC305 solder alloy doped with 0.1 Wt.% FNS was prepared via the powder metallurgy method. A sandwich-like sample and a U-shaped sample were designed and prepared to conduct an isothermal ageing test and an EM test. The isothermal ageing test was implemented under vacuum atmosphere at 150°C, whereas the EM experiment was carried out with a current density of 1.5 × 104 A/cm2. The microstructural and mechanical evolutions of both plain and composite solder joints after thermal ageing and EM stressing were comparatively studied. Findings A growth of Ag3Sn intermetallic compounds (IMCs) in solder matrix and Cu-Sn interfacial IMCs in composite solder joints was notably suppressed under isothermal ageing condition, whereas the hardness and shear strength of composite solder joints significantly outperformed those of non-reinforced solder joints throughout the ageing period. The EM experimental results showed that for the SAC305 solder, the interfacial IMCs formulated a protrusion at the anode after 360 h of EM stressing, whereas the surface of the composite solder joint was relatively smooth. During the stressing period, the interfacial IMC on the anode side of the plain SAC305 solder showed a continuous increasing trend, whereas the IMC at the cathode presented a decreasing trend for its thickness as the stressing time increased; after 360 h of stressing, some cracks and voids had formed on the cathode side. For the SAC305/FNS composite solder, a continuous increase in the thickness of the interfacial IMC was found on both the anode and cathode sides; the growth rate of the interfacial IMC at the anode was higher than that at the cathode. The nanoindentation results showed that the hardness of the SAC305 solder joint presented a gradient distribution after EM stressing, whereas the hardness data showed a relatively homogeneous distribution in the SAC305/FNS solder joint. Originality/value The experimental results showed that the FNS reinforcement could effectively mitigate the failure risk in solder joints under isothermal ageing and high-current stressing. Specifically, the FNS particles in solder joints can work as a barrier to suppress the diffusion and migration of Sn and Cu atoms. In addition, the nanoidentation results also indicated that the addition of the FNS reinforcement was very helpful in maintaining the mechanical stability of the solder joint. These findings have provided a theoretical and experimental basis for the practical application of this novel composite solder with high-current densities.

In-situ characterization of growth of isothermal ω phase in metastable β-Ti alloy TIMETAL LCB

Metastable β-Ti alloys exhibit various solid-solid phase transitions. Our study is focused on the characterization of the diffusion controlled β→ωiso phase transition. The particles of ω phase play an important part in thermomechanical treatment since they serve as heterogeneous nucleation sites for precipitation of finely dispersed particles of hexagonal α phase. The in-situ observation of the growth of particles of ω phase could be difficult by conventional techniques. However, it was shown recently that the ω phase significantly influences the elastic constants of the material, and the different forms of ω phase have different effects on the elastic anisotropy, as well as on the internal friction coefficients. Therefore, the β→ω phase transformation could be in-situ observed by the precise measurement of the tensor of elastic constants. In this contribution, we present the study of the kinetics of the β→ωiso phase transformation by resonant ultrasound spectroscopy. The polycrystalline samples of TIMETAL LCB alloy were in-situ examined by this technique during isothermal and non-isothermal ageing at temperatures up to 300 °C.