Electroplating and Electroless Deposition Processes for Electronic Components and Microsystems

2002 ◽  
pp. 1-17
Author(s):  
T. E. G. Daenen ◽  
D. L. Kubber
Keyword(s):  
Electroless Deposition ◽  
Electronic Components ◽  
Deposition Processes

The Wire Grid Polarizer Made by Electro- and Electroless- Deposition Processes

2013 ◽  
Vol 50 (32) ◽  
pp. 19-26
Author(s):  
N. Okamoto ◽  
Y. Ikeda ◽  
Y. Koyama ◽  
Y. Kawazu ◽  
T. Saito ◽  
...  
Keyword(s):  
Electroless Deposition ◽  
Wire Grid ◽  
The Wire ◽  
Deposition Processes ◽  
Wire Grid Polarizer

Carbon Nanotubes as Highly Conductive Nano-Fillers in Metallic Matrices

2008 ◽  
Vol 59 ◽  
pp. 131-137 ◽  
Author(s):  
C. Edtmaier ◽  
T. Janhsen ◽  
R.C. Hula ◽  
Laurent Pambaguian ◽  
Hans Georg Wulz ◽  
...  
Keyword(s):  
Electroless Deposition ◽  
Volume Fraction ◽  
Bulk Material ◽  
Deposition Process ◽  
Homogeneous Distribution ◽  
Matrix Composites ◽  
Copper Particles ◽  
Wet Chemical ◽  
Deposition Processes ◽  
Thermo Physical Properties

. A baseline electroless deposition processes for Cu on CNTs has been developed. This process results in the formation of copper particles of few tens of nanometres. Using this process in a CNT loaded solution it is possible to obtain a homogeneous distribution of CNTs and Cu, even for volume fraction of CNTs as high as 17 v%. By the application of wet chemical processing it is possible to penetrate the natural felt-like structure of the CNTs and to fill the gaps with copper particles. Variations of the baseline deposition process have been established, allowing adding small amount of nickel on the CNT prior to the copper deposition to strengthen the interfacial bonding between matrix and CNTs. Hot pressing of the highly CNT loaded metal matrix composites has been developed; it allows producing bulk material that can be handled. The microstructure of these materials has been investigated and samples have been machined for further testing, i.e. mechanical characterization and thermo-physical properties.

Molecular orbital study on the reaction mechanisms of electroless deposition processes

2001 ◽  
Vol 47 (1-2) ◽  
pp. 47-53 ◽  
Author(s):  
Takayuki Homma ◽  
Isao Komatsu ◽  
Amiko Tamaki ◽  
Hiromi Nakai ◽  
Tetsuya Osaka
Keyword(s):  
Molecular Orbital ◽  
Reaction Mechanisms ◽  
Electroless Deposition ◽  
Molecular Orbital Study ◽  
Orbital Study ◽  
Deposition Processes

ELECTROLESS DEPOSITION OF NICKEL ON LEAD ZIRCONIUM TITANATE CERAMICS: PREPARATION, MAGNETIC AND MAGNETOELECTRIC PROPERTIES

2012 ◽  
Vol 19 (06) ◽  
pp. 1250061
Author(s):  
K. BI ◽  
H. HONG ◽  
W. WU ◽  
Y. G. WANG
Keyword(s):  
Magnetic Properties ◽  
Electroless Deposition ◽  
X Ray Diffraction ◽  
Thermodynamics And Kinetics ◽  
Voltage Coefficient ◽  
Transmission Electron ◽  
Deposition Processes ◽  
Titanate Ceramics ◽  
Electroless Ni ◽  
Kinetics Of

The Ni layers with good soft magnetic properties have been successfully electroless deposited on PZT layers. To study the thermodynamics and kinetics of electroless Ni -deposition, the effect of bath parameters such as pH and temperature has been discussed. The structural, magnetic and magnetostrictive properties of Ni layers deposited at various pH and temperature are characterized by X-ray diffraction, transmission electron microscopy, vibrating sample magnetometer and standard strain-gauge technique. The grain size, deposition rate, magnetic properties and magnetostrictive properties of Ni layers and magnetoelectric effect of Ni /PZT/ Ni trilayers depend strongly on the thermodynamics and kinetics of electroless deposition processes. A maximum ME voltage coefficient of αE,31 = 5.8 V cm-1 Oe-1 is obtained at a frequency of about 101 kHz. These trilayers exhibit a promising potential in actuators, transducers and sensors.

Fabrication of Nickel/Gold Multilayered Shells on Polystyrene Bead Cores by Sequential Electroless Deposition Processes

2008 ◽  
Vol 37 (10) ◽  
pp. 1648-1652 ◽  
Author(s):  
Jun-Ho Lee ◽  
Jun Suk Oh ◽  
Pyong Chan Lee ◽  
Dong Ouk Kim ◽  
Youngkwan Lee ◽  
...  
Keyword(s):  
Electroless Deposition ◽  
Polystyrene Bead ◽  
Deposition Processes

Microstructural changes of Aluminum Nitride after laser irradiation and electroless copper deposition

1994 ◽  
Vol 52 ◽  
pp. 636-637
Author(s):  
S. Cao ◽  
A. J. Pedraza ◽  
L. F. Allard
Keyword(s):  
Aluminum Nitride ◽  
Laser Irradiation ◽  
Electroless Deposition ◽  
Thermal Evaporation ◽  
Surface Region ◽  
Near Surface ◽  
Laser Patterning ◽  
Electroless Copper ◽  
Excimer Laser Irradiation ◽  
Laser Effect

Excimer-laser irradiation strongly modifies the near-surface region of aluminum nitride (AIN) substrates. The surface acquires a distinctive metallic appearance and the electrical resistivity of the near-surface region drastically decreases after laser irradiation. These results indicate that Al forms at the surface as a result of the decomposition of the Al (which has been confirmed by XPS). A computer model that incorporates two opposing phenomena, decomposition of the AIN that leaves a metallic Al film on the surface, and thermal evaporation of the Al, demonstrated that saturation of film thickness and, hence, of electrical resistance is reached when the rate of Al evaporation equals the rate of AIN decomposition. In an electroless copper bath, Cu is only deposited in laser-irradiated areas. This laser effect has been designated laser activation for electroless deposition. Laser activation eliminates the need of seeding for nucleating the initial layer of electroless Cu. Thus, AIN metallization can be achieved by laser patterning followed by electroless deposition.

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