MegaCam: The next generation wide-field camera for CFHT

AbstractThere is a major opportunity for the KDUST 2.5 m telescope to carry out the next generation IR survey. A resolution of 0.2 arcsec is obtainable from Dome A over a wide field. This opens a unique discovery space during the 2015–2025 decade.A next generation 2μm survey will feed JWST with serendipitous targets for spectroscopy, including spectra and images of the first galaxies.

Download Full-text

Fibre assignment in next-generation wide-field spectrographs

Monthly Notices of the Royal Astronomical Society ◽

10.1111/j.1365-2966.2011.19774.x ◽

2011 ◽

Vol 419 (2) ◽

pp. 1187-1196 ◽

Cited By ~ 11

Author(s):

Isaac Morales ◽

Antonio D. Montero-Dorta ◽

Marco Azzaro ◽

Francisco Prada ◽

Justo Sánchez ◽

...

Keyword(s):

Wide Field ◽

Next Generation

Download Full-text

A broad energy range wide field monitor for next generation gamma-ray burst experiments

Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment ◽

10.1016/j.nima.2008.01.053 ◽

2008 ◽

Vol 588 (1-2) ◽

pp. 37-40 ◽

Cited By ~ 2

Author(s):

M. Marisaldi ◽

C. Labanti ◽

F. Fuschino ◽

L. Amati

Keyword(s):

Energy Range ◽

Gamma Ray ◽

Wide Field ◽

Next Generation ◽

Gamma Ray Burst ◽

Broad Energy Range ◽

Broad Energy

Download Full-text

A study of Sub-micron Fan-out Wafer Level Packaging solutions

International Symposium on Microelectronics ◽

10.4071/2380-4505-2018.1.000488 ◽

2018 ◽

Vol 2018 (1) ◽

pp. 000488-000493 ◽

Cited By ~ 2

Author(s):

Yoshio GOTO ◽

Kosuke URUSHIHARA ◽

Bunsuke TAKESHITA ◽

Ken-Ichiro MORI

Keyword(s):

Wave Front ◽

Line Width ◽

Image Sensors ◽

Wide Field ◽

Next Generation ◽

Wafer Level ◽

Wafer Level Packaging ◽

Manufacturing Methods ◽

Width Reduction ◽

Projection Optics

Abstract In Fan-out Wafer Level Packaging (FOWLP) processes, redistribution layer (RDL) line width reduction is a key challenge to expand the FOWLP market to multi-chip interconnections, including interconnections between SoC and DRAM, split-die connection of FPGA, and interconnections between image sensors and SoC. Next generation FOWLP requires 1.0 μm RDL and future FOWLP is targeting 0.8 μm RDL. To meet these requirements, Canon has developed new projection optics with a high NA and wide-field that is best suited for sub-micron FOWLP. These projection optics are a new option for FPA-5520iV steppers, offering NA 0.24 imaging and a 52 × 34 mm exposure field. FPA-5520iV steppers with NA 0.24 provide excellent 0.8 μm resolution performance throughout all imaging fields thanks to Canon's wave-front aberration based projection optics manufacturing methods and on-axis optical tilt focus sensor.

Download Full-text