Research on Reliability Improvement Scheme of Network in Smart Substation

Author(s):  
Bing Shen ◽  
Zhihao Lu ◽  
Hang Lv ◽  
Gui Yang ◽  
Li Li
2021 ◽  
Author(s):  
Zhimei Zhou ◽  
Xiaoke Tang ◽  
Li Yan ◽  
Linlin Tang ◽  
Shengya Han ◽  
...  

2009 ◽  
Vol 129 (10) ◽  
pp. 949-956
Author(s):  
Kohji Ajiki ◽  
Hiroaki Morimoto ◽  
Fumiyuki Shimokawa ◽  
Shinya Sakai ◽  
Kazuomi Sasaki ◽  
...  

Author(s):  
Michael Hertl ◽  
Diane Weidmann ◽  
Alex Ngai

Abstract A new approach to reliability improvement and failure analysis on ICs is introduced, involving a specifically developed tool for Topography and Deformation Measurement (TDM) under thermal stress conditions. Applications are presented including delamination risk or bad solderability assessment on BGAs during JEDEC type reflow cycles.


1978 ◽  
Author(s):  
J. L. Easterday ◽  
J. E. Drennan ◽  
L. R. Albrechtson ◽  
W. Gordon

Author(s):  
N Loganathan ◽  
J Prasanth ◽  
R Shankara Saravanan ◽  
V Jayasuriya ◽  
S Karthikeyan

IEEE Access ◽  
2021 ◽  
pp. 1-1
Author(s):  
Habes Ali Khawaldeh ◽  
Mohammad Al-soeidat ◽  
Majid Farhangi ◽  
Dylan Dah-Chuan Lu ◽  
Li Li

Author(s):  
Yuri R. Rodrigues ◽  
Morad Mohamed Abdelmageed Abdelaziz ◽  
Liwei Wang ◽  
Innocent Kamwa

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