Research on Reliability Improvement Scheme of Network in Smart Substation

Proceedings of 2020 International Top-Level Forum on Engineering Science and Technology Development Strategy and The 5th PURPLE MOUNTAIN FORUM (PMF2020) - Lecture Notes in Electrical Engineering ◽

10.1007/978-981-15-9746-6_5 ◽

2021 ◽

pp. 53-63

Author(s):

Bing Shen ◽

Zhihao Lu ◽

Hang Lv ◽

Gui Yang ◽

Li Li

Keyword(s):

Reliability Improvement ◽

Improvement Scheme ◽

Smart Substation

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Reliability improvement scheme of DDR controller based on FPGA

10.1109/aemcse51986.2021.00259 ◽

2021 ◽

Author(s):

Zhimei Zhou ◽

Xiaoke Tang ◽

Li Yan ◽

Linlin Tang ◽

Shengya Han ◽

...

Keyword(s):

Reliability Improvement ◽

Improvement Scheme

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Development of Reliability Improvement Process for Reducing Noises from the Drive Shaft in Automobiles

Journal of Applied Reliability ◽

10.33162/jar.2020.12.20.4.313 ◽

2020 ◽

Vol 20 (4) ◽

pp. 313-323

Author(s):

Hyukchoon Yun ◽

Suneung Ahn ◽

Suk Joo Bae

Keyword(s):

Drive Shaft ◽

Reliability Improvement ◽

Improvement Process

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Reliability Improvement of Ground Fault Protection System Using an S-Type Horn Attachment Gap in AC Feeding System

IEEJ Transactions on Industry Applications ◽

10.1541/ieejias.129.949 ◽

2009 ◽

Vol 129 (10) ◽

pp. 949-956

Author(s):

Kohji Ajiki ◽

Hiroaki Morimoto ◽

Fumiyuki Shimokawa ◽

Shinya Sakai ◽

Kazuomi Sasaki ◽

...

Keyword(s):

Protection System ◽

Feeding System ◽

Reliability Improvement ◽

Ground Fault ◽

Fault Protection ◽

Ground Fault Protection

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An Advanced Reliability Improvement and Failure Analysis Approach to Thermal Stress Issues in IC Packages

ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2009p0001 ◽

2009 ◽

Author(s):

Michael Hertl ◽

Diane Weidmann ◽

Alex Ngai

Keyword(s):

Thermal Stress ◽

Failure Analysis ◽

Deformation Measurement ◽

Stress Conditions ◽

Analysis Approach ◽

New Approach ◽

Reliability Improvement

Abstract A new approach to reliability improvement and failure analysis on ICs is introduced, involving a specifically developed tool for Topography and Deformation Measurement (TDM) under thermal stress conditions. Applications are presented including delamination risk or bad solderability assessment on BGAs during JEDEC type reflow cycles.

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