Glass-bonding techniques for semiconductor strain gages

1971 ◽  
Vol 11 (5) ◽  
pp. 235-240 ◽  
Author(s):  
W. A. Leasure ◽  
N. Woodruff ◽  
C. Gravel
Author(s):  
Christopher A. Suprock ◽  
Joseph J. Christian ◽  
Stan T. Rosinski

This paper discusses a specially developed semiconductor strain cell that allows sensitive measurement of surface strain in environments with temperatures up to 1050F (566C). There is an unmet industry-wide need in the manufacturing and power generation fields for monitoring material mechanics and component degradation at temperatures exceeding the maximum working temperature of traditional strain gage technologies. This technology advances attachment methodology of the semiconductor gage to allow field deployment and a physically reliable interface with structural strain. Measuring strain at these temperatures is useful both in the laboratory and in practical monitoring applications. The technology provides a way to monitor changes in materials exposed to heat and stress and give plant engineers tools to predict and avoid critical failures.


1964 ◽  
Vol 4 (6) ◽  
pp. 19A-26A
Author(s):  
James Dorsey

1987 ◽  
Vol 109 (2) ◽  
pp. 122-127 ◽  
Author(s):  
C. W. deSilva ◽  
T. E. Price ◽  
T. Kanade

This paper describes the development of a joint torque sensor for the second direct-drive manipulator at Carnegie-Mellon University (CMU DD Arm II). The approach taken is to develop the sensor using static design considerations and then test it to verify its dynamic performance. Several design considerations applicable to semiconductor strain-gage torque sensors are presented. These are strain capacity limit, nonlinearity, sensitivity, and stiffness specifications. Associated design equations have been developed in the present work. A numerical example is given to illustrate the use of these design considerations. The development of a circular-shaft torque sensor for the CMU DD Arm II, that employs semiconductor strain gages, is described. Typical results from a static calibration test and from step and impulse tests are presented. Test show that the torque sensor performs well under dynamic conditions in a bandwidth of 100 Hz.


1982 ◽  
Vol 104 (4) ◽  
pp. 838-843 ◽  
Author(s):  
U. Haupt ◽  
M. Rautenberg

On a high-pressure, high-mass flow, centrifugal compressor blade vibration measurements are carried out to determine the excitation mechanism in various operating ranges. For these experiments semiconductor strain gages were used. For the transmission of the signals, an 8 channel telemetry system has been installed. A research program was started with blade vibration measurements in different operating ranges of the compressor such as rotating stall, surge and flutter ranges and for the case of nonuniform flow conditions. The results of vibration tests with the impeller at rest showed the stress distribution and the strain directions during blade vibration. This information was used for the choice of the strain gage position on the blade. The experimental results were confirmed by a finite-element calculation considering a segment of the impeller with one blade, which determined the different vibration modes. Further, the steady strain distribution of the impeller due to centrifugal force and temperature was calculated. The investigations were completed by optical measurements to find out the vibration modes of the different blades in rotating operation. These tests were carried out by means of a holographic interferometric system with an optical derotator. The results show the various vibration modes of the blade up to a rotational speed of the compressor of 13,000 rpm.


1981 ◽  
Vol 17 (9) ◽  
pp. 914-919
Author(s):  
Mitsuo AI ◽  
Michitaka SHIMAZOE ◽  
Motohisa NISHIHARA ◽  
Kazuji YAMADA ◽  
Satoshi SHIMADA ◽  
...  

2013 ◽  
Vol 47 (7) ◽  
pp. 601-604 ◽  
Author(s):  
N. M. Volodin ◽  
Yu. N. Mishin ◽  
V. V. Kaminskii ◽  
Yu. V. Zakharov

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