Review on laser-induced etching processing technology for transparent hard and brittle materials

2021 ◽  
Author(s):  
Jialin Chen ◽  
Xizhao Lu ◽  
Qiuling Wen ◽  
Feng Jiang ◽  
Jing Lu ◽  
...  
Keyword(s):  
Brittle Materials ◽  
Processing Technology ◽  
Hard And Brittle Materials ◽  
Laser Induced Etching

Werkzeuge der ultraschallunterstützten Bearbeitung*/Modelling of an Actorsystem - Development of a tool for ultrasonic assisted machining with an axial-tangential vibration vector

2018 ◽  
Vol 108 (01-02) ◽  
pp. 53-57
Author(s):  
K. Drewle ◽  
T. Stehle ◽  
H: Möhring
Keyword(s):  
Contact Zone ◽  
Brittle Materials ◽  
Wird Eine ◽  
Alternative Method ◽  
Ultrasonic Assisted ◽  
Ultrasonic Assisted Machining ◽  
Hard And Brittle Materials ◽  
Feed Axis

Die schwingungsunterstützte Bearbeitung hat sich bereits bei der Zerspanung von hartspröden Werkstoffen mit einer einachsigen Schwingung in der Kontaktzone bewährt. Untersuchungen zu schwingungsunterstützten Bohrprozessen beschränken sich bisher auf eine Schwingungserzeugung, die entlang der Vorschubachse ausgerichtet ist. Für alternative Schwingungsrichtungen fehlt in erster Linie die geeignete Aktorik. In diesem Beitrag wird eine alternative Methode zur Erzeugung einer axial-tangentialen Schwingung in der Kontaktzone untersucht.   Ultrasonic assisted machining with uniaxial vibration is a well-proven process for machining hard and brittle materials. Existing investigations of vibration assisted drilling and boring processes so far are limited to an oscillation along the feed axis, which primarily due to nonexistent actuators. This contribution will present investigations into an alternative method for creating axial-tangential vibrations in the tool contact zone.

scholarly journals Extremely Thin Metal Foil Blades as Cutting Tools for Hard and Brittle Materials

2018 ◽  
Vol 221 ◽  
pp. 04006
Author(s):  
Satoshi Sakamoto ◽  
Sanshiro Akaoka ◽  
Masaya Gemma ◽  
Yasuo Kondo ◽  
Kenji Yamaguchi ◽  
...  
Keyword(s):  
Particle Size ◽  
Abrasive Particle ◽  
Brittle Materials ◽  
Groove Depth ◽  
Thin Metal ◽  
Metal Foil ◽  
Machining Time ◽  
Blade Thickness ◽  
Hard And Brittle Materials ◽  
Thin Metal Foil

The manufacturing costs of semiconductor products such as silicon wafers can be reduced by decreasing the kerf loss. In addition, a decrease in the kerf loss leads to an effective utilization of rare materials, which is environmentally beneficial from the viewpoint of saving resources. This study aims to reduce the kerf loss during slicing hard and brittle materials. Therefore, the possibility of using an extremely thin metal foil blade instead of a wire tool in slicing was examined. Initially, grooving characteristics using a metal foil blade (thickness: 50 μm or less) was investigated. The main conclusions are that grooving with a metal foil blade is possible and kerf loss can be reduced. The groove depth tends to increase as the machining time and particle size of abrasives increase. The groove width is smaller when a thin metal foil blade is used and vice versa. However, if the abrasive particle size is too large, grooving becomes impossible. Since the wear of metal foil blade increases with an increase in the particle size of the abrasive, it is necessary to use an abrasive with a particle size that is suitable for the thickness of the metal foil blade.

Study on Fixed Abrasive Lapping Hard and Brittle Materials with Brazed Micro Powder Diamond Disk

2013 ◽  
Vol 589-590 ◽  
pp. 451-456 ◽  
Author(s):  
Quan Cheng Li ◽  
Jian Yun Shen ◽  
Cong Fu Fang ◽  
Xi Peng Xu
Keyword(s):  
Surface Morphology ◽  
Silicon Wafer ◽  
Removal Rate ◽  
Brittle Materials ◽  
Alumina Ceramic ◽  
Diamond Disk ◽  
Hard And Brittle Materials ◽  
Fixed Abrasive

In this study, two different arrangement lapping disks fixed with brazed diamond pellets were used to lap silicon wafer and alumina ceramic. The effects of the surface morphology, roughness, and removal rate of workpiece caused by lapping pressure, lapping time, workpiece velocity, and disc arrangement were operated with serials experiments. The results of the researches provided guidance for fixed abrasive lapping of hard and brittle materials with the brazed micro powder diamond disk.

Dicing of hard and brittle materials with on-machine laser-dressed metal-bonded diamond blades

2014 ◽  
Vol 38 (1) ◽  
pp. 162-167 ◽  
Author(s):  
Philipp von Witzendorff ◽  
Manuel Stompe ◽  
Anas Moalem ◽  
Srecko Cvetkovic ◽  
Oliver Suttmann ◽  
...  
Keyword(s):  
Brittle Materials ◽  
Hard And Brittle Materials
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