Dynamic Error Compensation of Coordinate Measuring Machines for High-Speed Measurement

1999 ◽  
Vol 15 (11) ◽  
pp. 810-814 ◽  
Author(s):  
Y. H. Mu ◽  
B. K. A. Ngoi
2021 ◽  
Vol 92 (5) ◽  
pp. 054701
Author(s):  
T. Hennen ◽  
E. Wichmann ◽  
A. Elias ◽  
J. Lille ◽  
O. Mosendz ◽  
...  

Author(s):  
Yu Hirano ◽  
Masaru Kojima ◽  
Mitsuhiro Horade ◽  
Kazuto Kamiyama ◽  
Yasushi Mae ◽  
...  

1991 ◽  
Vol 224 ◽  
Author(s):  
C. Schietinger ◽  
B. Adams ◽  
C. Yarling

AbstractA novel wafer temperature and emissivity measurement technique for rapid thermal processing (RTP) is presented. The ‘Ripple Technique’ takes advantage of heating lamp AC ripple as the signature of the reflected component of the radiation from the wafer surface. This application of Optical Fiber Thermometry (OFT) allows high speed measurement of wafer surface temperatures and emissivities. This ‘Ripple Technique’ is discussed in theoretical and practical terms with wafer data presented. Results of both temperature and emissivity measurements are presented for RTP conditions with bare silicon wafers and filmed wafers.


1994 ◽  
Vol 05 (03) ◽  
pp. 253-274 ◽  
Author(s):  
MASAO OBARA ◽  
JUNKO AKAGI

AlGaAs/GaAs heterojunction bipolar transistor (HBT) high speed ICs have been paving the way for the most sophisticated fiber-optic communication systems since the late 1980s. Recently 20 Gbps HBT ICs have been developed to accommodate the emergence of optical fiber amplifiers. HBT technology is now proceeding towards the development of 40 Gbps systems where the lack of high speed measurement system remains an issue.


Sign in / Sign up

Export Citation Format

Share Document