Hybrid liquid metal–water cooling system for heat dissipation of high power density microdevices

Purpose The purpose of this paper is to ensure adequate thermal management to remove and dissipate the heat produced by a light-emitting diode (LED) and to guarantee reliable and safe operation. Design/methodology/approach A three-dimensional (3-D) computational fluid dynamics (CFD) model was used to analyze the distribution of fluid velocities among microchannels at four different aspect ratios. Findings The results showed that at the same inlet flow rate, the larger the aspect ratio of the microchannels, the better the uniformity of the internal fluid velocity and thus better the heat dissipation performance on the surface of the high-power LED chip. In addition, the thermal performance of a high-power LED water cooling system with four different aspect ratios’ microchannel structures is further studied experimentally. Specifically, the coupling effect between the fluid velocity distribution in the microchannels and the heat dissipation performance of a high-power LED water cooling system is qualitatively analyzed and compared with the simulation results of the fluid velocity distribution. The results fully demonstrated that a larger aspect ratio of the microchannels results in better heat dissipation performance on the surface of the high-power LED chip. Originality/value Optimizing the structural parameters to facilitate a relatively uniform velocity distribution to improve the water cooling system performance may be a key factor to be considered.

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Experiments of Electronic Water Cooling System on Different Inlet Type and with/without Vortex Fin inside

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.1051.881 ◽

2014 ◽

Vol 1051 ◽

pp. 881-885

Author(s):

Feng Chin Tsai ◽

Jen Ching Huang

Keyword(s):

Heat Generation ◽

High Power ◽

Heat Dissipation ◽

Cooling System ◽

Cooling Water ◽

Water Cooling ◽

Water Cooling System

This study mainly investigates the influence of electronic water cooling system on high power heat generation device at different cooling water inlets with vortex fins or not, hence, heat dissipation experiments are going to carried out on the conditions of three cooling cases: hollow case I, hollow case II and vortex-fin case. From this experiment, it can be seen that the heat dissipation efficiency of hollow case I is reduced by 10% as compared to that of hollow case II, and the heat dissipation efficiency of vortex-fin case is also reduced by 10% as compared to that of hollow case I, that is, water cooling system with vortex-fin has very excellent effect on heat dissipation.

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Design of Heat Dissipation for Temporary Overload of High Power Density Motor Based on Neutralization of High and Low Temperature

Mechanical Engineering and Technology ◽

10.12677/met.2021.105061 ◽

2021 ◽

Vol 10 (05) ◽

pp. 547-554

Author(s):

洋王

Keyword(s):

Low Temperature ◽

Power Density ◽

High Power ◽

Heat Dissipation ◽

High Power Density

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High Power-Density SiC Converter

Materials Science Forum ◽

10.4028/www.scientific.net/msf.600-603.1223 ◽

2008 ◽

Vol 600-603 ◽

pp. 1223-1226 ◽

Cited By ~ 4

Author(s):

Shin Ichi Kinouchi ◽

Hiroshi Nakatake ◽

T. Kitamura ◽

S. Azuma ◽

S. Tominaga ◽

...

Keyword(s):

Power Density ◽

High Power ◽

Power Loss ◽

Cooling System ◽

High Power Density ◽

Loss Reduction ◽

Effective Volume ◽

Similar Rating ◽

Power Densities ◽

System Volume

A compact SiC converter having power densities about 9 W/cm3 is designed and fabricated. It is confirmed that the converter operates in a thermally permissive range. The power loss of the module of the converter measured under motor operations is less than 50% of the similar-rating Si module loss. The shrink of the effective volume of DC-link capacitor is necessary to achieve the high power-density SiC converter, in addition to the decrease of the cooling system volume due to the loss reduction caused by SiC devices.

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