The effect of tool geometry on subsurface damage and material removal in nanometric cutting single-crystal silicon by a molecular dynamics simulation

2016 ◽  
Vol 122 (9) ◽  
Author(s):  
Houfu Dai ◽  
Genyu Chen ◽  
Qihong Fang ◽  
Jiu Yin
Keyword(s):  
Molecular Dynamics ◽  
Molecular Dynamics Simulation ◽  
Single Crystal ◽  
Material Removal ◽  
Single Crystal Silicon ◽  
Subsurface Damage ◽  
Dynamics Simulation ◽  
Tool Geometry ◽  
Crystal Silicon ◽  
Nanometric Cutting

Molecular Dynamics Simulation on the Mechanism of Nanometric Machining of Single-Crystal Silicon

2004 ◽  
Vol 471-472 ◽  
pp. 144-148 ◽  
Author(s):  
Hui Wu ◽  
Bin Lin ◽  
S.Y. Yu ◽  
Hong Tao Zhu
Keyword(s):  
Molecular Dynamics ◽  
Molecular Dynamics Simulation ◽  
Single Crystal ◽  
Single Crystal Silicon ◽  
Atomic Scale ◽  
Dynamics Simulation ◽  
Crystal Silicon ◽  
Nanometric Cutting ◽  
Simulation Techniques ◽  
Nanometric Machining

Molecular dynamics (MD) simulation can play a significant role in addressing a number of machining problems at the atomic scale. This simulation, unlike other simulation techniques, can provide new data and insights on nanometric machining; which cannot be obtained readily in any other theory or experiment. In this paper, some fundamental problems of mechanism are investigated in the nanometric cutting with the aid of molecular dynamics simulation, and the single-crystal silicon is chosen as the material. The study showed that the purely elastic deformation took place in a very narrow range in the initial stage of process of nanometric cutting. Shortly after that, dislocation appeared. And then, amorphous silicon came into being under high hydrostatic pressure. Significant change of volume of silicon specimen is observed, and it is considered that the change occur attribute to phase transition from a diamond silicon to a body-centered tetragonal silicon. The study also indicated that the temperature distributing of silicon in nanometric machining exhibited similarity to conventional machining.

scholarly journals Influence of laser nanostructured diamond tools on the cutting behavior of silicon by molecular dynamics simulation

RSC Advances ◽  
2017 ◽  
Vol 7 (25) ◽  
pp. 15596-15612 ◽  
Author(s):  
Houfu Dai ◽  
Genyu Chen ◽  
Shaobo Li ◽  
Qihong Fang ◽  
Bang Hu
Keyword(s):  
Molecular Dynamics ◽  
Molecular Dynamics Simulation ◽  
Large Scale ◽  
Diamond Tool ◽  
Single Crystal Silicon ◽  
Dynamics Simulation ◽  
Crystal Silicon ◽  
Nanometric Cutting ◽  
Dynamics Simulations ◽  
Cutting Behavior

In this study, a series of large-scale molecular dynamics simulations have been performed to study the nanometric cutting of single crystal silicon with a laser-fabricated nanostructured diamond tool.

Sign in / Sign up

Export Citation Format

Share Document