Practical Green’s function for the thermal stress field induced by a heat source in plane thermoelasticity

2020 ◽  
Vol 41 (4) ◽  
pp. 543-550
Author(s):  
Jian Hua ◽  
Ming Dai
Keyword(s):  
Thermal Stress ◽  
Stress Field ◽  
Heat Source ◽  
Green’S Function ◽  
Green's Function ◽  
Thermal Stress Field

Quasi-static thermal stresses due to a concentrated moving heat source in a thin plate

2016 ◽  
Vol 22 (2) ◽  
pp. 243-256
Author(s):  
Amir Reza Shahani ◽  
Samad Kalani
Keyword(s):  
Thermal Stress ◽  
Stress Field ◽  
Heat Source ◽  
Thin Plate ◽  
Thermal Stresses ◽  
Static Solution ◽  
Stress Distributions ◽  
Moving Heat Source ◽  
Displacement Potential ◽  
Thermal Stress Field

Temperature and thermal stress distributions in a two-dimensional infinite thin plate subjected to a moving heat source with variable power and velocity are obtained by solving quasi-static thermoelasticity equations analytically with the aid of a thermoelastic displacement potential. The results show good agreement with experimental data for a stationary source with constant power and with a steady-state analytical solution in the open literature. It is shown that the quasi-static solution can predict changes of the thermal stress field during the movement of the heat source, and can give the effect of changes of power and velocity of the heat source on the thermal stress field during its movement.

Numerical Simulation on Stress Field in Inside-Beam Laser Cladding

2014 ◽  
Vol 887-888 ◽  
pp. 1309-1312
Author(s):  
Ming Di Wang ◽  
Xiao Ling Hang ◽  
Kai Bo Guo ◽  
Shi Hong Shi ◽  
Lin Ning Sun
Keyword(s):  
Temperature Field ◽  
Thermal Stress ◽  
Stress Field ◽  
Heat Source ◽  
High Energy ◽  
Field Change ◽  
Change Over Time ◽  
Thermal Stress Field ◽  
Advanced Analysis ◽  
Over Time

In the process of deposition, the moving high energy heat source effect on the metal entity, and form the molten pool and the temperature field of directional conduction. Powder is accumulated in the substrate point by point, molten powder instantly solidify into a solid which is combined with substrate (or sediment) to reach metallurgical combination, from the perspective of the thermodynamic, the temperature field produced by coupling ring of heat source is regarded as a moving load to the base plate and the sedimentary section, and transient thermal stress field is generated, the load and boundary conditions (temperature field) of thermal stress field change over time, at the same time, the solution domain of thermal stress field change over time as a result. Therefore, through the life and death unit technology (ANSYS finite element analysis software of advanced analysis techniques) combined with the circulation order, the simulation of point to add deposition process is realized.

Effects of Scanning Patterns on the Thermal/Stress Field during Laser Solid Forming T-Shape Chord of Ti-6Al-4V Alloy

2014 ◽  
Vol 41 (7) ◽  
pp. 0703003
Author(s):  
姜亚琼 Jiang Yaqiong ◽  
林鑫 Lin Xin ◽  
马良 Ma Liang ◽  
谭华 Tan Hua ◽  
杨海欧 Yang Haiou ◽  
...  
Keyword(s):  
Thermal Stress ◽  
Stress Field ◽  
Laser Solid Forming ◽  
Thermal Stress Field
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