On-printed circuit board emulator with controllability of pinched hysteresis loop for nanoscale $$\mathrm{TiO}_2$$ TiO 2 thin-film memristor device

2016 ◽  
Vol 15 (3) ◽  
pp. 993-1002 ◽  
Author(s):  
Van Ha Nguyen ◽  
Keun Yong Sohn ◽  
Hanjung Song
Keyword(s):  
Thin Film ◽  
Hysteresis Loop ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Pinched Hysteresis Loop ◽  
Pinched Hysteresis ◽  
Memristor Device

Utilization of Natural Porphyrin Thin Films as a Photosensitizer for Photodetectors

2014 ◽  
Vol 896 ◽  
pp. 187-191 ◽  
Author(s):  
Utari ◽  
Atmanto Heru Wibowo ◽  
Budi Purnama ◽  
Kamsul Abraha
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Spin Coating ◽  
Printed Circuit Board ◽  
Energy Gap ◽  
Circuit Board ◽  
Printed Circuit ◽  
Number Of Layers ◽  
Maximum Current ◽  
Sensitive Characteristics

In this study, photodetectors were assembled using natural porphyrin as a sensitizer, and their energy gap properties were investigated. The natural porphyrin thin film layered devices used in the experiments were deposited by spin coating on a patterned electrode of Cu printed circuit board substrates. The photo sensitive characteristics were measured both with and without illumination by white light. The photo sensitive effect increased with the number of layers. A maximum current of 2.6 nA was obtained when the films consisted of three layers and the current increased to 7.9 nA for seven layers. To clarify the results, the dependence of the number of layers on the energy gap was evaluated. The experiment results showed that the energy gap decreased linearly with increasing number of layers. The mutual combination of the photo sensitive effect and energy gap indicated that it is possible to apply natural porphyrin as a sensitizer for photodetector applications.

Polymer waveguide sensor with tin oxide thin film integrated onto optical-electrical printed circuit board

2014 ◽  
Author(s):  
Jung Woon Lim ◽  
Seon Hoon Kim ◽  
Jong-Sup Kim ◽  
Jeong Ho Kim ◽  
Yune Hyoun Kim ◽  
...  
Keyword(s):  
Thin Film ◽  
Tin Oxide ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Oxide Thin Film ◽  
Polymer Waveguide ◽  
Printed Circuit ◽  
Waveguide Sensor

Fatigue Behavior of Thin Cu Foils for Flexible Printed Circuit Board

2007 ◽  
Vol 124-126 ◽  
pp. 1369-1372 ◽  
Author(s):  
Seung Woo Han ◽  
Ki Jeong Seo ◽  
Wan Doo Kim ◽  
Hak Joo Lee ◽  
Hyun Woo Lee ◽  
...  
Keyword(s):  
Thin Film ◽  
Printed Circuit Board ◽  
Fatigue Behavior ◽  
Fatigue Cracks ◽  
Short Circuit ◽  
Circuit Board ◽  
Fatigue Properties ◽  
Printed Circuit ◽  
Flexible Printed Circuit ◽  
Flexible Pcb

Flexible printed circuit board (PCB), which is used for folder and slide type cellular phones, consists of flexible copper clad laminate (FCCL) and cover layer. Through it an electric current is applied to liquid crystal display (LCD) from the main board of cellular phone. In thin Cu foils of flexible PCB fatigue cracks due to repeated bending motion generate and propagate, and they cause a short circuit. Fatigue behavior of thin Cu foils being used for flexible PCB must be evaluated and confirmed to resolve this problem. It is based on findings by several researches that the mechanical properties of thin film materials differ from those of their bulk counterparts. Thin film properties have been investigated over the last years; however fatigue behavior of thin films has not yet been studied as thoroughly as monotonic behavior. In this study fatigue properties of thin Cu foils for the application in flexible PCB are obtained. Fatigue testing was performed for two kinds of Cu foils that were made by rolling and electrochemical procedures respectively. Differences of fabrications in fatigue behavior of thin foils were distinguished. Especially for rolled Cu foils, effects of rolling directions in fatigue properties were evaluated.

High Performance Electrostatic Air Valves Formed by Thin-Film Lamination

1999 ◽  
Author(s):  
David K. Biegelsen ◽  
Patrick Cheung ◽  
Lars E. Swartz ◽  
Warren B. Jackson ◽  
Andrew A. Berlin ◽  
...  
Keyword(s):  
Thin Film ◽  
Laser Cutting ◽  
High Performance ◽  
Printed Circuit Board ◽  
Response Times ◽  
Pressure Differential ◽  
Circuit Board ◽  
Drive Voltage ◽  
Printed Circuit ◽  
Air Flows

Abstract Electrostatic flap valves for rapidly modulating air flows through directed jets have been fabricated by simple lamination techniques as extensions to standard printed circuit board technology. The flaps have thicknesses of a few microns whereas the lateral dimensions are several millimeters. The laser cutting and lamination processes are described here and the characteristics of the valves are presented. Flow rise and fall times of order 1 ms are demonstrated, the variations of response times with drive voltage and pressure differential are shown, and lifetimes greater than 4 × 108 are reported.

Reliability of Flex Coatings for High-Performance Applications

1993 ◽  
Vol 323 ◽  
Author(s):  
H. Tong ◽  
C. Wilson ◽  
T. Graham ◽  
L. Shi
Keyword(s):  
Thin Film ◽  
Thermal Cycling ◽  
High Performance ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Polymeric Coatings ◽  
Printed Circuit ◽  
Thin Film Silicon ◽  
Edge Connector

AbstractA study was undertaken to select a suitable coating for a high-pin-count flexible edge connector (Flex) that interconnected a multichip thin-film silicon carrier to a printed circuit board. The Flex with cantilevered inner leads were joined to the contact pads at the perimeter of the carrier. 15 polymeric coatings were evaluated by subjecting coated Flexes to tests consisting of inner lead bending, temperature/humidity/bias (85°C/80%/15 V/350 hours), corrosion, line peel, and/or pressure cooker (126°C/20 psig/120 hours). Inner lead bending measurements were performed to assess the potential of lead shorting at the inner lead bonding sites during thermal cycling. From this study, a low-stress silicone evolved as the best candidate. The results leading to this conclusion will be shown and discussed.

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