Study of parallel processing area extraction and data transfer number reduction for automatic GPU offloading of IoT applications

2019 ◽  
Vol 54 (3) ◽  
pp. 567-584
Author(s):  
Yoji Yamato
Keyword(s):  
Parallel Processing ◽  
Data Transfer ◽  
Transfer Number ◽  
Iot Applications

scholarly journals Secure Smart Cameras by Aggregate-Signcryption with Decryption Fairness for Multi-Receiver IoT Applications

Sensors ◽  
2019 ◽  
Vol 19 (2) ◽  
pp. 327 ◽  
Author(s):  
Subhan Ullah ◽  
Lucio Marcenaro ◽  
Bernhard Rinner
Keyword(s):  
Data Transfer ◽  
Single Step ◽  
Security And Privacy ◽  
Sensitive Information ◽  
Smart Camera ◽  
Sensitive Data ◽  
Smart Cameras ◽  
Iot Applications ◽  
Public Verifiability ◽  
Single Receiver

Smart cameras are key sensors in Internet of Things (IoT) applications and often capture highly sensitive information. Therefore, security and privacy protection is a key concern. This paper introduces a lightweight security approach for smart camera IoT applications based on elliptic-curve (EC) signcryption that performs data signing and encryption in a single step. We deploy signcryption to efficiently protect sensitive data onboard the cameras and secure the data transfer from multiple cameras to multiple monitoring devices. Our multi-sender/multi-receiver approach provides integrity, authenticity, and confidentiality of data with decryption fairness for multiple receivers throughout the entire lifetime of the data. It further provides public verifiability and forward secrecy of data. Our certificateless multi-receiver aggregate-signcryption protection has been implemented for a smart camera IoT scenario, and the runtime and communication effort has been compared with single-sender/single-receiver and multi-sender/single-receiver setups.

GaAs high-speed data transfer network for a parallel processing system

2002 ◽  
Author(s):  
Y. Kitaura ◽  
A. Kameyama ◽  
T. Terada ◽  
N. Uchitomi ◽  
T. Sudo ◽  
...  
Keyword(s):  
Parallel Processing ◽  
High Speed ◽  
Data Transfer ◽  
Processing System ◽  
High Speed Data

Low Power Communication Protocols for IoT-Enabled Applications

2018 ◽  
pp. 64-94 ◽  
Author(s):  
Manoj Devare
Keyword(s):  
Low Power ◽  
Power Supply ◽  
Data Transfer ◽  
Communication Protocols ◽  
Wireless Data ◽  
Iot Applications ◽  
Industrial Iot ◽  
Telecommunication Protocols ◽  
Energy Options ◽  
Hardware Platforms

The industrial IoT marching towards the digital twin and the broad spectrum of applications need the specialized low power protocols for communication and data transfer. This chapter provides a comprehensive discussion on the challenges, opportunities, use cases, platforms, and protocols for the deployment of low power protocols in the context of IoT applications. Moreover, discussion extends to the various custom techniques for energy saving in the communication of sensors to hardware, hardware to Cloud, and deferred data pushing in edge computing. The traditional wireless data transfer and communication protocols are suitable in case of the hardware platforms connected with seamless power supply. However, there is need of low power protocols 6LoWPAN, LoRaWAN, Sub 1, ZigBee, BLE, NFC, and other telecommunication protocols across several IoT applications. The SBCs and micro-controllers are not always equipped with these protocol-enabled hardware. This chapter addresses the suitable hardware and combination with low energy options as per the budget, range, and specifications.

Effects of Parallel Processing on Large Eddy Simulations in ANSYS Fluent

2016 ◽  
Author(s):  
Puxuan Li ◽  
Steve J. Eckels ◽  
Ning Zhang ◽  
Garrett W. Mann
Keyword(s):  
Parallel Processing ◽  
Data Transfer ◽  
Turbulence Models ◽  
Large Eddy Simulations ◽  
Grid Turbulence ◽  
Ansys Fluent ◽  
Square Duct ◽  
Eddy Simulation ◽  
Eddy Viscosity Model ◽  
Large Eddy

Parallel processing is an effective computation in which many calculations are carried out simultaneously. In this paper, effects of shared-memory parallel processing on Large Eddy Simulations (LES) in ANSYS Fluent are presented. Fluent provides parallel processing to improve the speed of running programs. LES is one of the most popular viscosity models for turbulence used in computational fluid dynamics (CFD). Three kinds of LES with different sub-grid turbulence models were evaluated: Smagorinsky-Lilly Model (Lilly model), Wall-Adapting Local Eddy-viscosity Model (WALE model) and Wall Modeled Large Eddy Simulation (WMLES model). The running speed of the different models simulating a square duct on a single computer are compared. The relationship between wall-clock time and number of processors reveals the performances of different LES models. The part of the time that is not parallelizable such as file IO and data transfer is also considered based on Amdahl’s law.

Reliability and Security Challenges in Electrical/Optical On-Chip Interconnects for IoT Applications

2020 ◽  
pp. 218-246
Author(s):  
Muhammad Rehan Yahya ◽  
Ning Wu ◽  
Zain Anwar Ali
Keyword(s):  
Communication Systems ◽  
Data Transfer ◽  
Smart Cities ◽  
Security Issues ◽  
Iot Applications ◽  
Security Challenges ◽  
Chip Processing ◽  
Share Data ◽  
Iot Devices ◽  
On Chip

The evolution of internet of things (IoT) applications, cloud computing, smart cities, and 4G/5G wireless communication systems have significantly increased the demands for on chip processing. Network on chip (NoC) is a viable alternative that can provide higher processing and bandwidth for increasing demands. NoC offers better performance and more flexibility with lower communication latency and higher throughput. However, use of NoC-based IoT devices have raised concerns on security and reliability of integrated chips (IC), which is used in almost every application. IoT devices share data that becomes vulnerable to attack and can be compromised during the data transfer. Keeping in view these security challenges, a detailed survey is presented that covers the security issues and challenges focusing on NoCs along with proposed countermeasures to secure on-chip communication. This study includes on-chip security issues for electrical as well as optical on-chip interconnects.

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