Phase orientation, interface structure, and properties of aged Cu-6 wt.% Ag

2008 ◽  
Vol 43 (6) ◽  
pp. 2006-2011 ◽  
Author(s):  
J. B. Liu ◽  
L. Meng
Entropy ◽  
2019 ◽  
Vol 21 (2) ◽  
pp. 164 ◽  
Author(s):  
Wei Zhang ◽  
Mingyang Zhang ◽  
Yingbo Peng ◽  
Fangzhou Liu ◽  
Yong Liu ◽  
...  

In this study, an effective way of applying Ti/Ni deposited coating to the surface of diamond single crystal particles by magnetron sputtering was proposed and novel high-entropy alloy (HEA)/diamond composites were prepared by spark plasma sintering (SPS). The results show that the interfacial bonding state of the coated diamond composite is obviously better than that of the uncoated diamond composite. Corresponding mechanical properties such as hardness, density, transverse fracture strength and friction properties of the coated diamond composite were also found to be better than those of the uncoated diamond composite. The effects of interface structure and defects on the mechanical properties of HEA/diamond composites were investigated. The research directions for further improving the structure and properties of high-entropy alloy/diamond composites were proposed.


2011 ◽  
Vol 314-316 ◽  
pp. 968-971
Author(s):  
Hui Li ◽  
Shang Qi Zhou ◽  
Ji Lan Kong

Be and HR-I stainless steel with AgCu28 as an interlayer was diffusion bonded by hot pressing,The microstructure,distribution of composition and phase,mechanical properties of the joints were analyzed using scanning electron microscopy(SEM),scanning auger microspectroy(SAM),x-ray diffraction(XRD) and material testing machine,and the relationship between composition and structure and properties,and the effect of interlayer materials AgCu28 alloy were also discussed.The results show that good joint can be obtained using AgCu28 alloy as an interlayer material,because it can reduce the mutual diffusion between beryllium and stainless steel elements,the formation of brittle intermetallic compounds between beryllium and stainless steel elements are avoided effectively to improve the diffusion bonding strength and properties.


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