Wettability, interfacial reaction and mechanical properties of Sn/Sn–CuZnAl solder and Cu sheet during solid–liquid diffusion
2019 ◽
Vol 30
(20)
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pp. 18462-18470
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Vol 27
(5)
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pp. 4839-4848
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Vol 65
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pp. 171-174
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Vol 418-420
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Vol 718
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Vol 14
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