Wettability, interfacial reaction and mechanical properties of Sn/Sn–CuZnAl solder and Cu sheet during solid–liquid diffusion

2019 ◽  
Vol 30 (20) ◽  
pp. 18462-18470 ◽  
Author(s):  
Lei Sun ◽  
Ming-he Chen ◽  
Liang Zhang ◽  
Lan-sheng Xie ◽  
Chun-chun Wei
2001 ◽  
Vol 65 (3) ◽  
pp. 171-174 ◽  
Author(s):  
Takahiro Hasegawa ◽  
Tetsumori Shinoda ◽  
Yoshihiro Oya-Seimiya

Metal Science ◽  
1974 ◽  
Vol 8 (1) ◽  
pp. 112-116 ◽  
Author(s):  
A. P. Titchener ◽  
J. A. Spittle

2011 ◽  
Vol 418-420 ◽  
pp. 1498-1501
Author(s):  
Wen Yuan Long ◽  
Pei Pei Li

The Ti/TiC/C laminated composite material was fabricated with the sheet of Ti and C by spark plasma sintering (SPS) technology. The effects of thickness ratio on the interface characteristics and mechanical properties of interfacial reaction were studied. The results show that: the reaction layer thickness increases with the thickness ratio. When the thickness ratio was 3:1, the degree of interfacial reaction was better in the case of other conditions are the same. The thickness of reaction layer achieved 33.58μm. The laminated composite bending strength and fracture power reached the maximum 3494.52MPa and 614.89×103J/m2, respectively. The greater fracture power, the more energy absorbed in the process of damage, the higher toughness improved.


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