A Solid–Liquid Diffusion Couple Study of Peritectic Reactions

The use of an electric field to activate the combustion synthesis of chromium silicides was investigated. Despite their relatively low adiabatic temperatures, all four silicides were synthesized by field-activated combustion synthesis. However, although self-propagating synthesis reactions were initiated, the products were not pure but contained other silicides and reactant phases. The purity of the samples increased with increasing field strength, and under the highest field, the products contained the desired silicide as the major phase with minor amounts of other stoichiometries. Observation of microstructural evolution in quenched reactions revealed the key role played by the liquid phases in the propagation of the combustion front. The phase Cr5Si3 was the first product of the interaction between the reactants when either solid–solid or solid–liquid processes were involved. These results were confirmed by isothermal solid–solid and solid–liquid diffusion couple experiments.

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EFFECT OF Mg AND TEMPERATURE ON Fe–Al ALLOY LAYER IN Fe/(Zn–6%Al–x%Mg) SOLID–LIQUID DIFFUSION COUPLES

Surface Review and Letters ◽

10.1142/s0218625x18500105 ◽

2017 ◽

Vol 24 (Supp01) ◽

pp. 1850010

Author(s):

LIU LIANG ◽

YA-LING LIU ◽

YA LIU ◽

HAO-PING PENG ◽

JIAN-HUA WANG ◽

...

Keyword(s):

Diffusion Couple ◽

Alloy Layer ◽

Al Alloy ◽

Diffusion Couples ◽

Phase Layer ◽

Liquid Diffusion ◽

Time Period ◽

Phase Layers ◽

Diffusion Temperature ◽

Solid Liquid

Fe/(Zn–6%Al–[Formula: see text]%Mg) solid–liquid diffusion couples were kept at various temperatures for different periods of time to investigate the formation and growth of the Fe–Al alloy layer. Scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and X-ray diffraction (XRD) were used to study the constituents and morphology of the Fe–Al alloy layer. It was found that the Fe2Al5Znxphase layer forms close to the iron sheet and the FeAl3Znxphase layer forms near the side of the melted Zn–6%Al–3%Mg in diffusion couples. When the Fe/(Zn–6%Al–3%Mg) diffusion couple is kept at 510[Formula: see text]C for more than 15[Formula: see text]min, a continuous Fe–Al alloy layer is formed on the interface of the diffusion couple. Among all Fe/(Zn–6%Al–[Formula: see text]%Mg) solid–liquid diffusion couples, the Fe–Al alloy layer on the interface of the Fe/(Zn–6% Al–3% Mg) diffusion couple is the thinnest. The Fe–Al alloy layer forms only when the diffusion temperature is above 475[Formula: see text]. These results show that the Fe–Al alloy layer in Fe/(Zn–6%Al–[Formula: see text]%Mg) solid–liquid diffusion couples is composed of Fe2Al5Znxand FeAl3Znxphase layers. Increasing the diffusing temperature and time period would promote the formation and growth of the Fe–Al alloy layer. When the Mg content in the Fe/(Zn–6%Al–[Formula: see text]%Mg) diffusion couples is 3%, the growth of the Fe–Al alloy layer is inhibited. These results may explain why there is no obvious Fe–Al alloy layer formed on the interface of steel with a Zn–6%Al–3%Mg coating.

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Interfacial reaction and properties of Sn/Cu solder reinforced with graphene nanosheets during solid–liquid diffusion and reflowing

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-021-07044-5 ◽

2021 ◽

Author(s):

Mu-lan Li ◽

Li-li Gao ◽

Liang Zhang ◽

Nan Jiang ◽

Su-juan Zhong ◽

...

Keyword(s):

Interfacial Reaction ◽

Graphene Nanosheets ◽

Liquid Diffusion ◽

Solid Liquid

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Solid–Liquid Diffusion and Phase Growth Kinetics in Mg-Ca Binary System

Materials Science Forum ◽

10.4028/www.scientific.net/msf.816.418 ◽

2015 ◽

Vol 816 ◽

pp. 418-423

Author(s):

Xin Li ◽

Bin Jiang ◽

Hong Yang ◽

Xiang Sheng Xia ◽

Jia Hong Dai ◽

...

Keyword(s):

Activation Energy ◽

Diffusion Layer ◽

Diffusion Mechanism ◽

Dendritic Structure ◽

Diffusion Time ◽

Diffusion Couples ◽

Phase Growth ◽

Liquid Diffusion ◽

Solid Liquid ◽

Exponential Relation

The solid–liquid diffusion between Mg and Mg-10 at.% Ca alloy was studied at a temperature range of 570°C to 630°C for 10, 20, 30min, respectively. Only one compound, Mg2Ca, was observed in the diffusion couples. As the diffusion time increased, the dendritic structure of the diffusion layer became coarser. The thickness of the diffusion layer had an exponential relation to the experimental temperature. The Mg2Ca phase was observed to follow parabolic growth with diffusion time, which suggested that the growth of the Mg2Ca phase was controlled by diffusion mechanism. The activation energy was determined to be 111.28 kJ/mol.

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Fabrication of Nb3Sn superconductors by the solid-liquid diffusion method using Sn rich CuSn alloy

Cryogenics ◽

10.1016/0011-2275(82)90100-x ◽

1982 ◽

Vol 22 (2) ◽

pp. 89-93 ◽

Cited By ~ 16

Author(s):

H. Yamasaki ◽

Y. Kimura

Keyword(s):

Diffusion Method ◽

Liquid Diffusion ◽

Solid Liquid

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Influences of silicon carbide nanowires addition on IMC growth behavior of pure Sn solder during solid-liquid diffusion

10.21203/rs.3.rs-351790/v1 ◽

2021 ◽

Author(s):

Mulan Li ◽

Liang Zhang ◽

Jiang Nan ◽

Sujuan Zhong ◽

Lei Zhang

Keyword(s):

Silicon Carbide ◽

Solder Joint ◽

Ductile Fracture ◽

Composite Solder ◽

Mechanical Performance ◽

Growth Behavior ◽

Liquid Diffusion ◽

Soldering Process ◽

Solid Liquid ◽

Pure Sn

Abstract In this paper, various mass fraction (0, 0.2, 0.4, 0.6, 0.8, 1.0 wt%) of silicon carbide nanowires (SiC) were incorporated into pure Sn solder to enhance the performances of Sn solder joint. The wetting behavior, shear strength and intermetallic compound (IMC) growth mechanism of Sn-xSiC/Cu solder during solid-liquid diffusion at 250°C was investigated systematically. The experiment results demonstrated that the wettability of Sn-xSiC/Cu solder had a significant improvement when the addition of SiC was up to 0.6 wt%, and excessive additives would degrade the wettability of the composite solder. The formation of the Cu6Sn5 IMC layer was observed at the Sn-xSiC solder/Cu interface. Meanwhile, SiC as an additive was conducive to restraining the growth of interfacial IMC during soldering process and the IMC thickness overtly fell down after doping 0.8 wt% SiC into Sn solder. Moreover, SiC addition would contribute to enhancing the mechanical performance of Sn solder joint. The fracture mechanism of solder joint changed from a mix of brittle and ductile fracture to a characteristic of typical ductile fracture.

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