HAp/Ti2Ni coatings of high bonding strength on Ti–6Al–4V prepared by the eutectic melting bonding method

2015 ◽  
Vol 26 (2) ◽  
Author(s):  
Ya-Jing Ye ◽  
Peng-Yan Wang ◽  
Ya-Peng Li ◽  
Da-Chuan Yin
Keyword(s):  
Bonding Strength ◽  
Eutectic Melting ◽  
High Bonding Strength ◽  
Bonding Method

High-Frequency and Low-Temperature Thermosonic Bonding of Lead-Free Microsolder Ball on Silver Pad Without Flux

2014 ◽  
Vol 136 (3) ◽  
Author(s):  
Fuliang Wang ◽  
Junhui Li ◽  
Lei Han
Keyword(s):  
Low Temperature ◽  
High Frequency ◽  
Bonding Strength ◽  
Bonding Temperature ◽  
Lead Free ◽  
High Bonding Strength ◽  
Solder Balls ◽  
Laser Soldering ◽  
Free Solder ◽  
Bonding Method

Lead-free solder balls are environment friendly; however, they require a high bonding temperature, which causes problems in the microelectronics package industry. To reduce the bonding temperature, a 60 kHz high-frequency thermosonic bonding method is proposed and realized using a lab bonder. Experimental results showed that this method could be used to bond a 300 μm-diameter Sn–Ag–0.5Cu microsolder ball onto a silver pad without flux at a low temperature of 160 °C in 3 s. A ball shear test showed that the high frequency led to a high bonding strength of 58.8 MPa, and a dimpled structure was observed at the bonding interface by SEM. Compare with the reflow method or laser soldering method, the proposed method requires a low bonding temperature and leads to a high bonding strength.

Fabrication of Bioactive Stainless Steel by the Function of Apatite Nuclei

2016 ◽  
Vol 696 ◽  
pp. 151-156 ◽  
Author(s):  
Takeshi Yabutsuka ◽  
Ryoki Karashima ◽  
Shigeomi Takai ◽  
Takeshi Yao
Keyword(s):  
Stainless Steel ◽  
Simulated Body Fluid ◽  
Bonding Strength ◽  
Body Fluid ◽  
Apatite Layer ◽  
Mechanical Interlocking ◽  
High Bonding Strength ◽  
Fluid Formation ◽  
Bonelike Apatite

Micropores were formed on the surfaces of stainless steel (SUS) by sandblasting methods and Apatite Nuclei (AN) were formed in the pores. By this treatments, a bioactive SUS was fabricated. Apatite-forming ability of the SUS was evaluated by immersing in an acellular simulated body fluid. Formation of bonelike apatite was induced on the surface of the SUS within 1 day. High bonding strength of the bonelike apatite layer was achieved by a mechanical interlocking effect between the bonelike apatite formed in the pores and the SUS specimen.

Polymer-Based Repair Mortar Containing Waste Perlite Powder

2021 ◽  
Vol 898 ◽  
pp. 73-79
Author(s):  
Radek Hermann ◽  
Jakub Hodul ◽  
Aleš Jakubík
Keyword(s):  
Mechanical Properties ◽  
Bonding Strength ◽  
Building Materials ◽  
Expanded Perlite ◽  
High Bonding Strength ◽  
Repair Mortar ◽  
Very High

This paper deals with the problematics of utilization of waste perlite from production of expanded perlite in polymer-based material. The goal of this paper is to develop repair mortar containing as high amount of waste perlite as possible as substitution for filler. The resulting mortar exhibits very high physical-mechanical properties such as high bonding strength to a large variety of building materials. The microstructure and the re-dispersibility of filler were also studied.

Effect of Temperature on the Interfacial Bonding Strength between PVB and Glass from RT to -50 °C

2011 ◽  
Vol 492 ◽  
pp. 61-65 ◽  
Author(s):  
Yuan Tian ◽  
Yi Wang Bao ◽  
De Tian Wan ◽  
Xiu Fang Wang ◽  
Zhi Ming Han
Keyword(s):  
Bonding Strength ◽  
Room Temperature ◽  
Testing Temperature ◽  
Interfacial Bonding ◽  
Effect Of Temperature ◽  
Laminated Glass ◽  
Interfacial Bonding Strength ◽  
Cooling Speed ◽  
Bonding Method ◽  
Shear Bonding Strength

Laminated glass and photovoltaic laminated glass are widely used in architecture. The interfacial bonding strengths between poly(vinyl butyral) (PVB) and glass were investigated by the cross-bonding method from room temperature to -50 °C. The loading speed was 5 mm/min, and the cooling speed was about 0.5 °C/min. The testing sample was hold at each temperature for half an hour. It was revealed that the testing temperature had great effect on the bonding strength. At room temperature, the tensile bonding strength was 11.49 MPa and the shear bonding strength was 6.61 MPa. With the temperature decreased from RT to -50 °C, the tensile bonding strength was decreased by 66.81%, but the shear bonding strength was increased by 212.16%. From RT to -30 °C, the change rates of the tensile and shear bonding strength bonding strength were 65.57% and 172.68% respectively, only 3.61% and 14.48% from -30 °C to -50 °C. The mechanism for the bonding strength depended on testing temperatures from RT to -50 °C was also discussed.

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