Growth Kinetics of Intermetallic Compounds During Interfacial Reactions Between SnAgCuGa Lead-Free Solder and Cu Substrate

2017 ◽  
Vol 56 (1-2) ◽  
pp. 108-112 ◽  
Author(s):  
HuiMing Chen ◽  
Genfeng Shang ◽  
Wang Yi Hu ◽  
Hang Wang
Keyword(s):  
Intermetallic Compounds ◽  
Growth Kinetics ◽  
Interfacial Reactions ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cu Substrate ◽  
Free Solder ◽  
Kinetics Of

Intermetallic compounds growth between Sn–3.5Ag lead-free solder and Cu substrate by dipping method

2005 ◽  
Vol 392 (1-2) ◽  
pp. 192-199 ◽  
Author(s):  
D.Q. Yu ◽  
C.M.L. Wu ◽  
C.M.T. Law ◽  
L. Wang ◽  
J.K.L. Lai
Keyword(s):  
Intermetallic Compounds ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cu Substrate ◽  
Free Solder

scholarly journals Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls

2004 ◽  
Vol 45 (3) ◽  
pp. 754-758 ◽  
Author(s):  
Ikuo Shohji ◽  
Yuji Shiratori ◽  
Hiroshi Yoshida ◽  
Masahiko Mizukami ◽  
Akira Ichida
Keyword(s):  
Growth Kinetics ◽  
Flip Chip ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Balls ◽  
Free Solder ◽  
Kinetics Of Reaction ◽  
Kinetics Of

Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free solder and Ni substrate

2007 ◽  
Vol 22 (10) ◽  
pp. 2663-2667 ◽  
Author(s):  
Yee-wen Yen ◽  
Wei-kai Liou
Keyword(s):  
Intermetallic Compounds ◽  
Interfacial Reactions ◽  
Experimental Results ◽  
Lead Free ◽  
Lead Free Solder ◽  
Ni Substrate ◽  
Free Solder

This study investigates interfacial reactions of (Sn–9Zn) + xCu/Ni systems. Ni5Zn21, Cu5Zn8, (Ni,Zn,Cu)3Sn4, (Cu,Ni,Zn)6Sn5, and Cu6Sn5 phases were formed on the Sn–9Zn/Ni interface at 240–270 °C, when 0–10 wt% Cu was added to the Sn–9Zn solder. Experimental results indicate that changing the concentration of Cu in the Sn–9Zn solder dramatically changes the formation of intermetallic compounds (IMCs) in the (Sn–9Zn) + xCu/Ni system. Different diffusion and segregation rates of elements are the main reasons for a change in the IMC evolution.

Effect of Isothermal Aging on the Growth and Morphology of the Intermetallic Compounds Formed at the Solder/Cu Interface of the Lead - Free Solder Joint

2007 ◽  
Vol 561-565 ◽  
pp. 2115-2118
Author(s):  
Yun Fu ◽  
Qi Zhang ◽  
Feng Sun ◽  
Hao Yu Bai
Keyword(s):  
Solder Joint ◽  
Intermetallic Compounds ◽  
Aging Time ◽  
Isothermal Aging ◽  
Lead Free ◽  
Intermetallic Compound Layer ◽  
Lead Free Solder ◽  
Cu Substrate ◽  
Cu6sn5 Layer ◽  
Free Solder

The growth and morphology of the intermetallic compounds (IMC) formed at the interface between the solder ( Sn–3.5Ag–0.5Cu ) and the Cu substrate of the lead - free solder joint have been investigated by means of isothermal aging at 125°C. The scalloped Cu6Sn5 intermetallic compound layer was formed at the interface between the solder and Cu substrate upon reflow. The thickness of Cu6Sn5 layer increased with aging time. Cu3Sn appeared between Cu6Sn5 layer and Cu substrate when isothermally aged for 100 hours. Compare to Cu6Sn5 , the thickness of Cu3Sn was rather low, and nearly did not increase with aging time. In this paper, the comparison was made among the Sn-Pb and the Sn-Ag-Cu(SAC) solders which were pre-treated differently before soldering.

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