Soldering-induced Cu diffusion and intermetallic compound formation between Ni/Cu under bump metallization and SnPb flip-chip solder bumps

Journal of Electronic Materials ◽

10.1007/s11664-004-0134-6 ◽

2004 ◽

Vol 33 (4) ◽

pp. 283-289 ◽

Author(s):

Chien-Sheng Huang ◽

Guh-Yaw Jang ◽

Jenq-Gong Duh

Keyword(s):

Intermetallic Compound ◽

Flip Chip ◽

Under Bump Metallization ◽

Compound Formation ◽

Solder Bumps ◽

Intermetallic Compound Formation

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Intermetallic compound formation and morphology evolution in the 95Pb5Sn flip-chip solder joint with Ti/Cu/Ni under bump metallization during reflow soldering

Journal of Electronic Materials ◽

10.1007/s11664-005-0163-9 ◽

2005 ◽

Vol 34 (12) ◽

pp. 1543-1549 ◽

Author(s):

Kai-Zheng Wang ◽

Chih-Ming Chen

Keyword(s):

Intermetallic Compound ◽

Solder Joint ◽

Flip Chip ◽

Morphology Evolution ◽

Under Bump Metallization ◽

Compound Formation ◽

Reflow Soldering ◽

Intermetallic Compound Formation

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Intermetallic compound formation and diffusion path evolution in eutectic tin‐lead flip chip solder bumps after aging

Soldering & Surface Mount Technology ◽

10.1108/09540910610665099 ◽

2006 ◽

Vol 18 (2) ◽

pp. 18-26 ◽

Author(s):

Li‐Yin Hsiao ◽

Jenq‐Gong Duh

Keyword(s):

Intermetallic Compound ◽

Flip Chip ◽

Diffusion Path ◽

Compound Formation ◽

Solder Bumps ◽

Intermetallic Compound Formation ◽

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Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration

Journal of Applied Physics ◽

10.1063/1.3410796 ◽

2010 ◽

Vol 107 (9) ◽

pp. 093715 ◽

Author(s):

S. W. Liang ◽

Chih Chen ◽

J. K. Han ◽

Luhua Xu ◽

K. N. Tu ◽

...

Keyword(s):

Intermetallic Compound ◽

Flip Chip ◽

Whisker Growth ◽

Solder Joints ◽

Compound Formation ◽

Intermetallic Compound Formation

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Intermetallic Compound Formation and Growth Kinetics in Flip Chip Joints Using Sn–3.0Ag–0.5Cu Solder and Ni–P under Bump Metallurgy

MATERIALS TRANSACTIONS ◽

10.2320/matertrans.46.1295 ◽

2005 ◽

Vol 46 (6) ◽

pp. 1295-1300 ◽

Author(s):

Dae-Gon Kim ◽

Seung-Boo Jung

Keyword(s):

Intermetallic Compound ◽

Growth Kinetics ◽

Flip Chip ◽

Compound Formation ◽

Intermetallic Compound Formation

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Intermetallic Compound Formation and Diffusion Path Evolution in the Flip Chip Sn-37Pb Solder Bump after Aging

2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis ◽

10.1109/hdp.2005.251393 ◽

2005 ◽

Author(s):

Li-yin Hsiao ◽

Jenq-gong Duh

Keyword(s):

Intermetallic Compound ◽

Flip Chip ◽

Solder Bump ◽

Diffusion Path ◽

Compound Formation ◽

Intermetallic Compound Formation ◽

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Kinetic study of the intermetallic compound formation between eutectic Sn–3.5Ag alloys and electroplated Ni metallization in flip-chip solder joints

Journal of Materials Research ◽

10.1557/jmr.2012.22 ◽

2012 ◽

Vol 27 (8) ◽

pp. 1169-1177 ◽

Author(s):

Hsiao-Yun Chen ◽

Chih Chen

Keyword(s):

Intermetallic Compound ◽

Kinetic Study ◽

Flip Chip ◽

Solder Joints ◽

Compound Formation ◽

Intermetallic Compound Formation ◽

Abstract

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Impact of Mechanical Property Degradation and Intermetallic Compound Formation on Electromigration-Oriented Failure of a Flip-Chip Solder Joint

Journal of Electronic Materials ◽

10.1007/s11664-020-08514-y ◽

2020 ◽

Vol 50 (1) ◽

pp. 233-248

Author(s):

Md. Tusher Ahmed ◽

Mohammad Motalab ◽

Jeffrey C. Suhling

Keyword(s):

Mechanical Property ◽

Intermetallic Compound ◽

Solder Joint ◽

Flip Chip ◽

Compound Formation ◽

Intermetallic Compound Formation

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Characterization of Intermetallic Compound Formation on In/Bi/Sn Solder Bumps Used in Pb-Alloy Josephson Chip Packaging

IEEE Transactions on Components Hybrids and Manufacturing Technology ◽

10.1109/tchmt.1987.1134729 ◽

1987 ◽

Vol 10 (2) ◽

pp. 263-266 ◽

Author(s):

K. Fujiwara ◽

M. Asahi

Keyword(s):

Intermetallic Compound ◽

Compound Formation ◽

Solder Bumps ◽

Intermetallic Compound Formation

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Interfacial reactions and compound formation in the edge of PbSn flip-chip solder bumps on Ni/Cu under-bump metallization

Journal of Electronic Materials ◽

10.1007/s11664-003-0022-5 ◽

2003 ◽

Vol 32 (11) ◽

pp. 1273-1277 ◽

Author(s):

Chien-Sheng Huang ◽

Guh-Yaw Jang ◽

Jeng-Gong Duh

Keyword(s):

Flip Chip ◽

Interfacial Reactions ◽

Under Bump Metallization ◽

Compound Formation ◽

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Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization

Thin Solid Films ◽

10.1016/j.tsf.2004.05.045 ◽

2004 ◽

Vol 462-463 ◽

pp. 363-369 ◽

Author(s):

Min He ◽

Zhong Chen ◽

Guojun Qi ◽

C.C. Wong ◽

S.G. Mhaisalkar

Keyword(s):

Intermetallic Compound ◽

Cooling Rate ◽

Under Bump Metallization ◽

Compound Formation ◽

Intermetallic Compound Formation

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