scholarly journals Intermetallic Compound Formation and Growth Kinetics in Flip Chip Joints Using Sn–3.0Ag–0.5Cu Solder and Ni–P under Bump Metallurgy

2005 ◽  
Vol 46 (6) ◽  
pp. 1295-1300 ◽  
Author(s):  
Dae-Gon Kim ◽  
Seung-Boo Jung
Keyword(s):  
Intermetallic Compound ◽  
Growth Kinetics ◽  
Flip Chip ◽  
Compound Formation ◽  
Intermetallic Compound Formation

scholarly journals Gold-Aluminium Intermetallic Compound Formation

1980 ◽  
Vol 6 (3-4) ◽  
pp. 147-150 ◽  
Author(s):  
E. Galli ◽  
G. Majni ◽  
C. Nobili ◽  
G. Ottaviani
Keyword(s):  
Activation Energy ◽  
Intermetallic Compound ◽  
Growth Kinetics ◽  
Failure Mechanisms ◽  
Main Mechanism ◽  
Compound Formation ◽  
Intermetallic Compound Formation ◽  
Failure Avoidance ◽  
Kinetics Of

During investigations of failure mechanisms and failure avoidance we have studied the kinetics and the mechanisms responsible for the growth of the Au-Al compounds. Au4Al, Au5Al2, Au2Al, AuAl, AuAl2have been observed and the growth kinetics of the Au2Al, AuAl, AuAl2follow a(time)1/2dependence. The activation energy for the growth of Au2Al is 1 eV and 1.2 eV was found for AuAl and AuAl2. The kind of compound formed depends on the samples preparation and the results indicate that the kinetics of the mixing is the main mechanism responsible for the sequence of formation of the various compounds.

Effect of adding Ag to the medium entropy SnBiIn alloy on intermetallic compound formation

2020 ◽  
Vol 272 ◽  
pp. 127891 ◽  
Author(s):  
Li Pu ◽  
Yingxia Liu ◽  
Yong Yang ◽  
Quanfeng He ◽  
Ziqing Zhou ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Compound Formation ◽  
Intermetallic Compound Formation
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