Intermetallic Compound Formation and Diffusion Path Evolution in the Flip Chip Sn-37Pb Solder Bump after Aging

2005 ◽  
Author(s):  
Li-yin Hsiao ◽  
Jenq-gong Duh
Keyword(s):  
Intermetallic Compound ◽  
Flip Chip ◽  
Solder Bump ◽  
Diffusion Path ◽  
Compound Formation ◽  
Intermetallic Compound Formation ◽  
And Diffusion

Failure behavior upon shear test of 5Sn–95Pb solder bump after high temperature reliability test

2004 ◽  
Vol 19 (8) ◽  
pp. 2471-2477 ◽  
Author(s):  
Yeh-Hsiu Liu ◽  
Chiang-Ming Chuang ◽  
Kwang-Lung Lin
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Intermetallic Compound ◽  
Shear Test ◽  
Flip Chip ◽  
Failure Modes ◽  
Solder Bump ◽  
Failure Behavior ◽  
Intermetallic Compound Formation ◽  
Long Time

The shear strength, intermetallic compound formation, and failure mechanism of high-lead solder (5Sn–95Pb) bump on flip chip under bump metallurgy, Al/Ni(V)/Cu, were investigated after thermal cycling, multiple reflow, and high-temperature aging. Two kinds of intermetallic compound, Cu3Sn and AlxNiy, were found at the interface. The Cu3Sn was formed between the solder and Ni(V) layer while AlxNiy was formed between Ni(V) and Al layer. The formation of the Cu3Sn compound will not affect the shear strength, 27–30 g, of the solder bump even after a high temperature long time aging test. However, the shear strength after the 30th reflow drops to less than 25 g, ascribed to the formation of a brittle compound, AlxNiy. The failure modes of the solder bump upon shear test were also discussed.

Effect of adding Ag to the medium entropy SnBiIn alloy on intermetallic compound formation

2020 ◽  
Vol 272 ◽  
pp. 127891 ◽  
Author(s):  
Li Pu ◽  
Yingxia Liu ◽  
Yong Yang ◽  
Quanfeng He ◽  
Ziqing Zhou ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Compound Formation ◽  
Intermetallic Compound Formation
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