Kinetic study of the intermetallic compound formation between eutectic Sn–3.5Ag alloys and electroplated Ni metallization in flip-chip solder joints
2012 ◽
Vol 27
(8)
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pp. 1169-1177
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Keyword(s):
Abstract
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2005 ◽
Vol 34
(12)
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pp. 1543-1549
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2006 ◽
Vol 35
(5)
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pp. 897-904
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2006 ◽
Vol 18
(2)
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pp. 18-26
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Keyword(s):
2005 ◽
Vol 46
(6)
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pp. 1295-1300
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Keyword(s):
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2004 ◽
Vol 33
(4)
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pp. 283-289
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2008 ◽
Vol 13
(8)
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pp. 781-790
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