Impact of Mechanical Property Degradation and Intermetallic Compound Formation on Electromigration-Oriented Failure of a Flip-Chip Solder Joint

2020 ◽  
Vol 50 (1) ◽  
pp. 233-248
Author(s):  
Md. Tusher Ahmed ◽  
Mohammad Motalab ◽  
Jeffrey C. Suhling
Keyword(s):  
Mechanical Property ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Flip Chip ◽  
Compound Formation ◽  
Intermetallic Compound Formation

Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint

2017 ◽  
Vol 728 ◽  
pp. 992-1001 ◽  
Author(s):  
Junghwan Bang ◽  
Dong-Yurl Yu ◽  
Yong-Ho Ko ◽  
Min-Su Kim ◽  
Hiroshi Nishikawa ◽  
...  
Keyword(s):  
Mechanical Property ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Lead Free ◽  
Lead Free Solder ◽  
Compound Formation ◽  
Intermetallic Compound Formation ◽  
Free Solder

Intermetallic Compound Formation and Mechanical Property of Inner Lead Bonding Joints

2014 ◽  
Vol 4 (10) ◽  
pp. 1739-1744
Author(s):  
Chih-Fan Lin ◽  
Chih-Ming Chen ◽  
Wei-Ping Dow ◽  
Hung-Hsin Liu ◽  
Ho-Chun Tien ◽  
...  
Keyword(s):  
Mechanical Property ◽  
Intermetallic Compound ◽  
Compound Formation ◽  
Intermetallic Compound Formation
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