Manufacturing and Characterization of Sn-0.6Al Lead-Free Composite Solder Using Accumulative Extrusion Process

Author(s):  
N. Zamani Bakhtiarvand ◽  
A. Taherizadeh ◽  
A. Maleki ◽  
M. A. Karimi
Author(s):  
D.C. Lin ◽  
C.Y. Kuo ◽  
T.S. Srivatsan ◽  
M. Petraroli ◽  
G.X. Wang

A series of experiments conducted on a lead-free eutectic solder (Sn-3.5%Ag) have shown that addition of trace amounts of nanometer-sized particles does have an influence on mechanical properties of materials. In this study, three different types of nanoparticles (copper, nickel and iron) were chosen as the reinforcing candidate. For each particulate reinforcement the reflow process was performed under identical cooling conditions. Addition of trace amounts of nano-particles alters the kinetics governing solidification of the composite solder paste while concurrently exerting an influence on microstructural development, particularly the formation and presence of second phases in the solidified end product. The nano-sized powder particle-reinforced composite solder revealed an increase in microhardness compared to the unreinforced monolithic counterpart.


2008 ◽  
Vol 20 (3) ◽  
pp. 11-17 ◽  
Author(s):  
O. Nousiainen ◽  
T. Kangasvieri ◽  
R. Rautioaho ◽  
J. Vähäkangas

2013 ◽  
Vol 50 (3) ◽  
pp. 177-195
Author(s):  
D. Živković ◽  
A. Mitovski ◽  
S. Novaković ◽  
Lj. Balanović ◽  
D. Marković ◽  
...  
Keyword(s):  

2016 ◽  
Vol 27 (7) ◽  
pp. 7204-7210 ◽  
Author(s):  
S. M. Mane ◽  
P. M. Tirmali ◽  
D. J. Salunkhe ◽  
P. B. Joshi ◽  
C. B. Kolekar ◽  
...  

2010 ◽  
Author(s):  
M. Pattanaik ◽  
P. Kumar ◽  
Dinesh K. Aswal ◽  
Anil K. Debnath

2011 ◽  
Vol 110 (4) ◽  
pp. 044503 ◽  
Author(s):  
Ming-Ru Yang ◽  
Sheng-Yuan Chu ◽  
I-Hao Chan ◽  
Sheng-Kai Huang

Materials ◽  
2015 ◽  
Vol 8 (11) ◽  
pp. 7962-7978 ◽  
Author(s):  
Philippe Veber ◽  
Feres Benabdallah ◽  
Hairui Liu ◽  
Gabriel Buse ◽  
Michael Josse ◽  
...  
Keyword(s):  

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