Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering
1999 ◽
Vol 28
(11)
◽
pp. 1231-1237
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Keyword(s):
2020 ◽
1980 ◽
Vol 45
(12)
◽
pp. 3402-3407
◽
Keyword(s):
2012 ◽
Vol 90
(5)
◽
pp. 696-703
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Keyword(s):