Influence of particle size and surfactants on uniformity and quantity of silicon carbide particles in electrodeposited nickel-silicon carbide coatings

2021 ◽  
Vol 28 (6) ◽  
pp. 1627-1636
Author(s):  
Hong-min Kan ◽  
Yuan-yuan Meng ◽  
Ramana G. Reddy
2012 ◽  
Vol 529-530 ◽  
pp. 553-558 ◽  
Author(s):  
Hiroshi Mizuno ◽  
Takeshi Yabutsuka ◽  
Takeshi Yao

Micropores were formed on the surface of Ti metal, Ti-15Mo-5Zr-3Al alloy, Ti-12Ta-9Nb-3V-6Zr-O alloy plate by doubled sandblasting process using silicon carbide particles with 14.0 μm for average particle size as first process, then using the particles with 3.0 μm for average particle size as second process. Apatite Nuclei (AN) were precipitated in the pores. By these treatments, bioactive AN-precipitated Ti alloys were fabricated. Bioactivity of the AN-precipitated Ti alloys was examined by soaking in SBF and it was observed that hydroxyapatite was induced on the surface of the Ti alloys within 1 d. High adhesive strength of hydroxyapatite layer was achieved due to a mechanical interlocking effect between hydroxyapatite formed in the micropores and the plate.


2014 ◽  
Vol 631 ◽  
pp. 231-235 ◽  
Author(s):  
Takeshi Yabutsuka ◽  
Hiroshi Mizuno ◽  
Ryoki Karashima ◽  
Takeshi Yao

Micropores were formed on the surface of Ti-15Mo-5Zr-3Al alloy plate by doubled sandblasting process using silicon carbide particles with 14.0 μm and/or 3.0 µm average particle size by changing the combination of the size of particles. Apatite Nucleus (AN) was precipitated in the pores. By these treatments, bioactive AN precipitated Ti alloys were fabricated. Bioactivity of the Ti alloys was examined by soaking in SBF. Formed hydroxyapatite showed highest adhesive strength in the case of sandblasting using 14.0 μm particles then using 3.0 μm particles.


2019 ◽  
Vol 944 ◽  
pp. 705-713
Author(s):  
Xiao Hong Wang ◽  
Qiao Gang Hu ◽  
Shi Yu Zhong ◽  
Teng Dang ◽  
Hai Lun Wang ◽  
...  

The wettability between silicon carbide and aluminum is poor, silicon carbide is difficult to fuse or the distribution of silicon carbide is not uniform in the ingot when the SiCp / 7075 composite is prepared by melt casting.The surface modification of SiCp by nickel plating can significantly reduce the wetting angle of SiC/Al and improve the distribution uniformity of silicon carbide in SiCp / 7075. In this thesis, the thermal compression process 6.5% SiCp / 7075 reinforced by nickel-plated modified silicon carbide is simulated by DEFOEM-3D software.The influence of the shape and particle size of nickel-plated modified silicon carbide on its compressive damage has been highlighted, and the deformation characteristics of the SiC/Ni/Al interface layer in the thermal compression process have been discussed. The numerical simulation results show that the 6.5% SiCp / 7075 reinforced by spherical nickel-plated modified silicon carbide particles with a particle size of 15 μm has the smallest compression damage value of 0.0426, at this point the compression temperature is 400°C, the compression ratio is 15, and the compression rate is 0.03s-1. the hot compression test of 6.5% SiCp / 7075 reinforced by spherical nickel-plated modified silicon carbide particles with a particle size of 15 μm was performed by using the same compression parameters as the numerical simulation. After hot pressing, the sample had a smooth surface with few obvious cracks, which was consistent with the numerical simulation results. Key words: nickel-plating modification; silicon carbide particles; compressive damage; grain size; grain morphology


2012 ◽  
Vol 512-515 ◽  
pp. 951-954
Author(s):  
Bing Bing Fan ◽  
Huan Huan Guo ◽  
Jian Li ◽  
Hai Long Wang ◽  
Ke Bao ◽  
...  

The SiC/Cu composite is one of the "structural-functional" materials. It shows good mechanical properties and very high thermal, high electrical conductivity etc. But the co-dispersion, wetting and bonding between SiC and Cu interface are of practical importance in the preparation of SiC/Cu composites. In this work, surface treatment techniques such as high-temperature oxidation, acid dipping and alkaline wash were adopted separately on silicon carbide particles, in order to improve the wettability and physical and chemical compatibility between silicon carbide and copper, then we used the replacement reaction method and decomposition-reduction reaction method to generate Cu coating on the surface of silicon carbide. The results shown that, the surface of silicon carbide particle which treated by alkaline wash was cleaner and more rough than that only treated by high-temperture oxidation, moreover, the specific surface of the particle was increased, which resulted in a compact layer of Cu coating. for the same silicon carbide particles, the effect of the Cu coating prepared by decomposition reaction method was better than that by reduction reaction method.


2021 ◽  
Vol 1035 ◽  
pp. 768-772
Author(s):  
Jing Kun Li ◽  
Xue Ping Ren ◽  
Qiang Yan ◽  
Yan Ling Zhang ◽  
Hong Liang Hou

Porous silicon carbide was sintered at 1300 °C/30 MPa for 2 h with 4 wt.% magnesium alloy and 4 wt.% chromium carbide composite additives. The sintered ceramic presented density of around 92% of the theoretical density. No new phase was observed after sintering. Mg segregates around chromium carbide particles in sintered ceramic. The silicon carbide particles were mainly bonded by melt magnesium alloy and chromium carbide diffused in solid state. The voids existed in the sintered ceramic, but much more fracture occurred in silicon carbide particles during bending due to high bonding strength of sintering necks. Some voids existed in the ceramic, which act as crack sources during fracture.


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