Modulation of Antioxidant Machinery and the Methylglyoxal Detoxification System in Selenium-Supplemented Brassica napus Seedlings Confers Tolerance to High Temperature Stress

2014 ◽  
Vol 161 (3) ◽  
pp. 297-307 ◽  
Author(s):  
Mirza Hasanuzzaman ◽  
Kamrun Nahar ◽  
Md. Mahabub Alam ◽  
Masayuki Fujita
Keyword(s):  
High Temperature ◽  
Brassica Napus ◽  
Temperature Stress ◽  
High Temperature Stress ◽  
Detoxification System ◽  
Antioxidant Machinery

Seed yield and water use efficiency of canola (Brassica napus L.) as affected by high temperature stress and supplemental irrigation

2009 ◽  
Vol 96 (1) ◽  
pp. 132-140 ◽  
Author(s):  
Abolfazl Faraji ◽  
Nasser Latifi ◽  
Afshin Soltani ◽  
Amir Hossain Shirani Rad
Keyword(s):  
High Temperature ◽  
Brassica Napus ◽  
Water Use Efficiency ◽  
Temperature Stress ◽  
Water Use ◽  
Seed Yield ◽  
High Temperature Stress ◽  
Brassica Napus L ◽  
Supplemental Irrigation ◽  
Use Efficiency

Assessment of wheat (Triticum aestivum L.) genotypes for high temperature stress tolerance using physico-chemical analysis

2020 ◽  
Vol 53 (2) ◽  
Author(s):  
Khalil Ahmed Laghari ◽  
Abdul Jabbar Pirzada ◽  
Mahboob Ali Sial ◽  
Muhammad Athar Khan ◽  
Jamal Uddin Mangi
Keyword(s):  
Triticum Aestivum ◽  
High Temperature ◽  
Chemical Analysis ◽  
Stress Tolerance ◽  
Temperature Stress ◽  
Triticum Aestivum L ◽  
High Temperature Stress ◽  
Physico Chemical

Genome-wide identification and analysis of maize PAL gene family and its expression profile in response to high-temperature stress

2020 ◽  
Vol 52 (5) ◽  
Author(s):  
De-Gong Wu ◽  
Qiu-Wen Zhan ◽  
Hai-Bing Yu ◽  
Bao-Hong Huang ◽  
Xin-Xin Cheng ◽  
...  
Keyword(s):  
High Temperature ◽  
Gene Family ◽  
Temperature Stress ◽  
Expression Profile ◽  
High Temperature Stress ◽  
Genome Wide

Impact of Metal Pad Etch-Induced Plasma Damage on Dynamic Retention Time Degradation during High Temperature Stress in High Density DRAM Technology

2005 ◽  
Author(s):  
D-J Kim ◽  
I-G Kim ◽  
J-Y Noh ◽  
H-J Lee ◽  
S-H Park ◽  
...  
Keyword(s):  
High Temperature ◽  
Temperature Stress ◽  
Retention Time ◽  
High Temperature Stress ◽  
High Density ◽  
Cell Junction ◽  
Antenna Effect ◽  
Plasma Damage ◽  
Root Cause ◽  
Wafer Processing

Abstract As DRAM technology extends into 12-inch diameter wafer processing, plasma-induced wafer charging is a serious problem in DRAM volume manufacture. There are currently no comprehensive reports on the potential impact of plasma damage on high density DRAM reliability. In this paper, the possible effects of floating potential at the source/drain junction of cell transistor during high-field charge injection are reported, and regarded as high-priority issues to further understand charging damage during the metal pad etching. The degradation of block edge dynamic retention time during high temperature stress, not consistent with typical reliability degradation model, is analyzed. Additionally, in order to meet the satisfactory reliability level in volume manufacture of high density DRAM technology, the paper provides the guidelines with respect to plasma damage. Unlike conventional model as gate antenna effect, the cell junction damage by the exposure of dummy BL pad to plasma, was revealed as root cause.

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