High-precision transfer-printing and integration of vertically oriented semiconductor arrays for flexible device fabrication

Nano Research ◽  
2014 ◽  
Vol 7 (7) ◽  
pp. 998-1006 ◽  
Author(s):  
Mark Triplett ◽  
Hideki Nishimura ◽  
Matthew Ombaba ◽  
V. J. Logeeswarren ◽  
Matthew Yee ◽  
...  
Author(s):  
Vladislav Khayrudinov ◽  
Tomi Koskinen ◽  
Kacper Grodecki ◽  
Krzysztof Murawski ◽  
Małgorzata Kopytko ◽  
...  

Author(s):  
John R. McPhillimy ◽  
Benoit Guilhabert ◽  
Charalambos Klitis ◽  
Stuart May ◽  
Martin D. Dawson ◽  
...  

2020 ◽  
Vol 58 (2) ◽  
pp. 145-150
Author(s):  
Tae Wan Park ◽  
Woon Ik Park

The nanofabrication of modern electronic devices requires advanced nanopatterning technologies. To fabricate desirable nanodevices with excellent device performance, controlling the shape and dimension of the pattern is very important. However, to achieve more facile and faster device fabrication, with better pattern resolution, pattern-tunability, process simplicity, and cost-effectiveness, some remaining challenges still need to be resolved. In this study, we introduce a simple and practical method to generate various patterns using a nanotransfer printing (nTP) process. To obtain functional materials with diverse shapes on a polymer replica pattern, in the nTP process we controlled the angle of deposition before transfer-printing. First, we obtained three different pattern shapes with a thickness of ~ 30 nm on polymethyl methacrylate (PMMA) replica patterns. Then, the deposited functional patterns on the PMMA patterns are successfully transfer-printed onto SiO<sub>2</sub>/Si substrates, showing line, L-shape line, and concavo-convex patterns. We observed the pattern shapes of the patterns by scanning electron microscope (SEM) and optical microscope. Moreover, we systemically analyzed how to form patterns of various shapes using one kind of master mold. We expect that this simple approach will be widely used to fabricate various useful patterns for electronic device applications.


2005 ◽  
Vol 12 (4) ◽  
pp. 345-351 ◽  
Author(s):  
Brahm Pal Singh ◽  
Kazutoshi Onozawa ◽  
Kazuhiko Yamanaka ◽  
Tomoaki Tojo ◽  
Daisuke Ueda

ACS Nano ◽  
2016 ◽  
Vol 10 (4) ◽  
pp. 3951-3958 ◽  
Author(s):  
Benoit Guilhabert ◽  
Antonio Hurtado ◽  
Dimitars Jevtics ◽  
Qian Gao ◽  
Hark Hoe Tan ◽  
...  

Carbon ◽  
2009 ◽  
Vol 47 (1) ◽  
pp. 321-324 ◽  
Author(s):  
B. Kumar ◽  
H.S. Tan ◽  
N. Ramalingam ◽  
S.G. Mhaisalkar

2013 ◽  
Vol 1553 ◽  
Author(s):  
Mark Triplett ◽  
Hideki Nishimura ◽  
Matthew Ombaba ◽  
M. Saif Islam

ABSTRACTFlexible devices utilizing crystalline semiconductor nano or microstructures materials are attractive for many applications. However, these materials are fabricated or grown in unusable forms for flexible systems due to their rigid crystalline mother substrates. We demonstrate a transfer printing technique for transferring vertical arrays of one-dimensional (1D) materials from mother substrates to flexible substrates with subsequent device fabrication steps to create flexible devices from these arrays. The transfer printing technique is based on vertical embossing of arrays of 1D materials into thermoplastic (Poly (methyl methacrylate) (PMMA)) transfer layers, while the device fabrication steps rely on encapsulation with insulating polymers and contact deposition. We investigated the use of flexible insulating layers like polydimethylsiloxane (PDMS) and polyurethane (PU) which are shown to be effective for encapsulation and contact isolation. Representative flexible resistive devices were created from these transferred arrays and insulating layers which showed a reversible tactile characteristic. Electronic characterization and flexibility testing was carried out to show the potential of these methods for enabling large-scale integrations of nano and microstructures into vertical and flexible packages.


2021 ◽  
Author(s):  
J. A. Smith ◽  
Paul Hill ◽  
Charalambos Klitis ◽  
Marc Sorel ◽  
P. A. Postigo ◽  
...  

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