scholarly journals Experimental characterization of the compressive mechanical behaviour of Ti6Al4V alloy at constant strain rates over the full elastoplastic range

2020 ◽  
Vol 13 (5) ◽  
pp. 709-724 ◽  
Author(s):  
Víctor Tuninetti ◽  
Paulo Flores ◽  
Marian Valenzuela ◽  
Gonzalo Pincheira ◽  
Carlos Medina ◽  
...  
Keyword(s):  
Mechanical Behaviour ◽  
Ti6al4v Alloy ◽  
Strain Rates ◽  
Experimental Characterization ◽  
Elastoplastic Range

Experimental characterization of the mechanical behaviour of components and materials of stone masonry railway bridges

2017 ◽  
Vol 153 ◽  
pp. 663-681 ◽  
Author(s):  
António Arêde ◽  
Cristina Costa ◽  
António Topa Gomes ◽  
José Eduardo Menezes ◽  
Rúben Silva ◽  
...  
Keyword(s):  
Mechanical Behaviour ◽  
Stone Masonry ◽  
Experimental Characterization ◽  
Railway Bridges

scholarly journals Experimental characterization of B500A and RB500W building steels in compression and in tension

2018 ◽  
Vol 183 ◽  
pp. 04004
Author(s):  
Leopold Kruszka ◽  
Jacek Janiszewski
Keyword(s):  
Dynamic Testing ◽  
Hopkinson Bar ◽  
Detailed Knowledge ◽  
Strain Rates ◽  
Building Structures ◽  
Experimental Characterization ◽  
Wide Range ◽  
Tension And Compression ◽  
Protective Structures

The paper covers static and dynamic testing of structural building steels grades B500A and RB500W in tension and compression under wide range of strain rates. The spilt Hopkinson bar technique apparatus is used to investigate the dynamic behaviours both in compression and tension. A detailed knowledge of mechanical properties of those steels at different strain rates at two modes of large deformation is crucial, because the steels are the most commonly used in building structures as well as in protective structures due to their good strength characteristics.

Experimental Characterization of the Reliability of 3-Terminal Dual-Damascene Copper Interconnect Trees

2002 ◽  
Vol 716 ◽  
Author(s):  
C. L. Gan ◽  
C. V. Thompson ◽  
K. L. Pey ◽  
W. K. Choi ◽  
F. Wei ◽  
...  
Keyword(s):  
Stress Conditions ◽  
Experimental Characterization ◽  
Contact Lines ◽  
Tree Structures ◽  
Similar Test ◽  
Dual Damascene ◽  
Copper Interconnect ◽  
Test Conditions

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.

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