Purpose
This paper aims to evaluate the concentration effect of red mud waste filler on mechanical and thermal properties of amine functional aniline furfuraldehyde condensate (AFAFFC) modified epoxy composite along with the optimum result of modified epoxy.
Design/methodology/approach
For effective toughening, different compositions were made by adding various concentration of AFAFFC to epoxy. The concentration of 2, 5 and 10 parts per hundred parts of epoxy resin of aluminium silicate-based pristine red mud waste was incorporated into the each modified epoxy matrix. These filled modified matrixes were cured with ambient temperature curing agent triethylene tetramine and evaluated with respect to their impact, tensile and flexural strengths. The morphology was analyzed by scanning electron microscopy and dynamic mechanical analysis. The thermal stability by thermogravimetric analysis was also reported.
Findings
The modification of epoxy resin using AFAFFC and filler showed significant enhancement of mechanical strength over unmodified epoxy. The increase depends on the concentration of the modifier and filler. The reason behind this is that in the initial stage of curing, the AFAFFC are miscible with the epoxy and form a homogeneous solution. This good mixing promotes the chemical reaction and network formation. During the curing process, as the molecular weight increases, the component separates with in the reaction medium to form a second dispersed phase.
Research Limitations/implications
The present paper discussed the effect of only one type of modifier, i.e. AFAFFC, and one filler, i.e. red mud waste filler effect. Besides these by changing the amine and aldehyde, other modifiers could be synthesised and the efficiency of modification of epoxy resin using these modifiers and other filler besides red mud waste such as paddy husk, bamboo dust, etc., could also be studied.
Originality/value
The present study regarding the concentration effect of modifier and filler was novel, and AFAFFC modified filled epoxy could be used in the field of coating, casting, adhesives, potting and encapsulation of semiconductor devices.
