Fabrication of h-BN Filled Epoxy-Based Thermally Conductive Adhesive Tapes Containing Cyclic Carbonate-Terminated Oligomers

2021 ◽  
Author(s):  
Gayoung Lim ◽  
Goseong Bok ◽  
Young-Seok Kim ◽  
Youngmin Kim
Keyword(s):  
Cyclic Carbonate ◽  
Conductive Adhesive ◽  
Thermally Conductive

Thermally Conductive Adhesive from Chemically Modified Cellulose and Nanoparticle of Surfactant-Doped Polypyrrole

2015 ◽  
Vol 353 (1) ◽  
pp. 24-30 ◽  
Author(s):  
Sarifah Fauziah Syed Draman ◽  
Rusli Daik ◽  
Said M. El-Sheikh ◽  
Famiza Abdul Latif
Keyword(s):  
Conductive Adhesive ◽  
Chemically Modified ◽  
Thermally Conductive ◽  
Modified Cellulose

Z-Axis Conductive, Stress Free, Thermally Conductive Adhesive Films and Pastes for Die- and Component Attach

1990 ◽  
pp. 273-274
Author(s):  
Kevin K. T. Chung ◽  
Garrett Dreier ◽  
Eldon Avery ◽  
Andy Boyle ◽  
William Koehn ◽  
...  
Keyword(s):  
Conductive Adhesive ◽  
Thermally Conductive

scholarly journals Recent Advances on Thermally Conductive Adhesive in Electronic Packaging: A Review

Polymers ◽  
2021 ◽  
Vol 13 (19) ◽  
pp. 3337
Author(s):  
Md. Abdul Alim ◽  
Mohd Zulkifly Abdullah ◽  
Mohd Sharizal Abdul Aziz ◽  
R. Kamarudin ◽  
Prem Gunnasegaran
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Electronic Packaging ◽  
Epoxy Adhesive ◽  
Conductive Adhesive ◽  
Future Research ◽  
Epoxy Adhesives ◽  
Recent Advances ◽  
Thermally Conductive ◽  
Conductive Fillers

The application of epoxy adhesive is widespread in electronic packaging. Epoxy adhesives can be integrated with various types of nanoparticles for enhancing thermal conductivity. The joints with thermally conductive adhesive (TCA) are preferred for research and advances in thermal management. Many studies have been conducted to increase the thermal conductivity of epoxy-based TCAs by conductive fillers. This paper reviews and summarizes recent advances of these available fillers in TCAs that contribute to electronic packaging. It also covers the challenges of using the filler as a nano-composite. Moreover, the review reveals a broad scope for future research, particularly on thermal management by nanoparticles and improving bonding strength in electronic packaging.

Anti-oxidation of Epoxy Resin Conductive Adhesive Copper Powder

2013 ◽  
Vol 30 (6) ◽  
pp. 677 ◽  
Author(s):  
Shimei DAI ◽  
Guangshuai HAN ◽  
Caigang DU ◽  
Yanmin GAO
Keyword(s):  
Epoxy Resin ◽  
Copper Powder ◽  
Conductive Adhesive

Sustainable Solid Catalysts for Cyclic Carbonate Synthesis from CO2 and Epoxide

2015 ◽  
Vol 19 (8) ◽  
pp. 681-694 ◽  
Author(s):  
Xian-Dong Lang ◽  
Xiao-Fang Liu ◽  
Liang-Nian He
Keyword(s):  
Cyclic Carbonate ◽  
Solid Catalysts
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