scholarly journals Recent Advances on Thermally Conductive Adhesive in Electronic Packaging: A Review

Polymers ◽  
2021 ◽  
Vol 13 (19) ◽  
pp. 3337
Author(s):  
Md. Abdul Alim ◽  
Mohd Zulkifly Abdullah ◽  
Mohd Sharizal Abdul Aziz ◽  
R. Kamarudin ◽  
Prem Gunnasegaran
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Electronic Packaging ◽  
Epoxy Adhesive ◽  
Conductive Adhesive ◽  
Future Research ◽  
Epoxy Adhesives ◽  
Recent Advances ◽  
Thermally Conductive ◽  
Conductive Fillers

The application of epoxy adhesive is widespread in electronic packaging. Epoxy adhesives can be integrated with various types of nanoparticles for enhancing thermal conductivity. The joints with thermally conductive adhesive (TCA) are preferred for research and advances in thermal management. Many studies have been conducted to increase the thermal conductivity of epoxy-based TCAs by conductive fillers. This paper reviews and summarizes recent advances of these available fillers in TCAs that contribute to electronic packaging. It also covers the challenges of using the filler as a nano-composite. Moreover, the review reveals a broad scope for future research, particularly on thermal management by nanoparticles and improving bonding strength in electronic packaging.

Enhanced thermal management performance of nanofibrillated cellulose composite with highly thermally conductive boron phosphide

2021 ◽  
Author(s):  
Jiajun Hu ◽  
Hongyan Xia ◽  
Xinguang Hou ◽  
Ting Yang ◽  
Kang Si ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Composite Film ◽  
Molten Salt ◽  
Thermal Management ◽  
Nanofibrillated Cellulose ◽  
Molten Salt Method ◽  
Boron Phosphide ◽  
Thermally Conductive ◽  
Conductive Fillers ◽  
Cellulose Composite

BP powders with high thermal conductivity were synthesized by a facile molten salt method and used as thermal conductive fillers to prepare nanofibrillated cellulose composite film with higher thermal conductivity.

scholarly journals Measurements of Aluminum-Annealed Pyrolytic Graphite Composite Baseplates with Improved Thermal Conductivity

2021 ◽  
Vol 16 (2) ◽  
pp. 042-047
Author(s):  
Yanfei Bian ◽  
SHI Jian-zhou ◽  
XIE Ming-jun ◽  
CAI Meng
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Thermal Management ◽  
Pure Aluminum ◽  
Pyrolytic Graphite ◽  
Aluminum Plate ◽  
Graphite Composite ◽  
Conductive Composites ◽  
Thermal Potential ◽  
Thermally Conductive

Annealed pyrolytic graphite (APG) is a material with thermal conductivity of about 1500 W/(m·K). This property may enable the usage of APG’s thermal potential to develop highly thermally conductive composites for devices requiring effective thermal management. In this paper, APG has been encapsulated in aluminum by brazing, and the thermal properties of Al-APG composite baseplates were measured. The results show that the thermal conductivity of the Al-APG composite baseplates is about 620 W/(m·K), which is four times higher than the pure aluminum plate (152 W/(m·K)).

scholarly journals Practical PBT/PC/GNP composites with anisotropic thermal conductivity

RSC Advances ◽  
2019 ◽  
Vol 9 (62) ◽  
pp. 36316-36323 ◽  
Author(s):  
Xiaolei Zheng ◽  
Bianying Wen
Keyword(s):  
Thermal Conductivity ◽  
Polymer Blends ◽  
Preparation Method ◽  
Selective Distribution ◽  
Conductive Composites ◽  
Anisotropic Thermal Conductivity ◽  
Thermally Conductive ◽  
Conductive Fillers

The selective distribution of thermally conductive fillers in a co-continuous polymer blends provides an industrialized preparation method that takes into account both the properties and functions of thermally conductive composites.

scholarly journals Effect of incorrect mix ratio on strength of two component adhesive Butt-Joints tested at elevated temperature

2018 ◽  
Vol 244 ◽  
pp. 01019
Author(s):  
Jakub Szabelski
Keyword(s):  
Elevated Temperature ◽  
Material Properties ◽  
Mixed Type ◽  
Epoxy Adhesive ◽  
Future Research ◽  
Butt Joints ◽  
Adhesive Material ◽  
Epoxy Adhesives ◽  
Two Component ◽  
The Impact

The aim of this study was to determine the impact of the incorrect mix ratio on the strength of joints bonded with a commercial epoxy adhesive compo-sition. The performance of cold-cured as well as accelerated cured butt joints was monitored at elevated temperature conditions. The obtained data was subjected to statistical analysis to show the correlation between joint strength at high temperature and incorrect mix ratio. The degradation of adhesive material properties with increase of hardener ratio in adhesive material was observed, as well as the change in failure type from mixed type to clearly cohesive (for inadequate volume of harde-ner) or adhesive (for excessive amount of hardener). Surprisingly insufficiency of hardener doesn’t affect the strength of joint in such manner. General recommend-dation were drawn for the preparation of two-component epoxy adhesives for joints to be used in elevated temperature, particularly when uncertainty regarding the correct resin/hardener mix ratio and future research was planned.

Fabrication of thermally conductive and electrically insulating polymer composites with isotropic thermal conductivity by constructing a three-dimensional interconnected network

Nanoscale ◽  
2019 ◽  
Vol 11 (23) ◽  
pp. 11360-11368 ◽  
Author(s):  
Hao Yuan ◽  
Yang Wang ◽  
Ting Li ◽  
Yijie Wang ◽  
Piming Ma ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Thermal Management ◽  
Three Dimensional ◽  
Heat Removal ◽  
Interconnected Network ◽  
Microelectronic Devices ◽  
Thermally Conductive

Efficient heat removal via thermal management materials has become one of the most critical challenges in the development of modern microelectronic devices.

Antimicrobial hexagonal boron nitride nanoplatelet composites for the thermal management of medical electronic devices

2019 ◽  
Vol 3 (11) ◽  
pp. 2455-2462 ◽  
Author(s):  
Si-Wei Xiong ◽  
Pan Zhang ◽  
Yu Xia ◽  
Pei-Gen Fu ◽  
Jing-Gang Gai
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Thermal Management ◽  
Hexagonal Boron Nitride ◽  
Electronic Devices ◽  
E Coli ◽  
Thermally Conductive ◽  
Medical Electronic

We developed a thermally conductive and antimicrobial QACs@h-BN/LLDPE composites for thermal management of medically electronic devices, it was approximately 100% against both E. coli and S. aureus and its thermal conductivity can reach 1.115 W m−1 K−1.

Flexible polyurethane/boron nitride composites with enhanced thermal conductivity

2019 ◽  
Vol 32 (3) ◽  
pp. 324-333 ◽  
Author(s):  
Ting Fei ◽  
Yanbao Li ◽  
Baocheng Liu ◽  
Chengbo Xia
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Thermal Management ◽  
High Stability ◽  
Heat Dissipation ◽  
Thermoplastic Polyurethane ◽  
Thermally Conductive ◽  
Mechanical Bending ◽  
Flexible Polyurethane ◽  
Enhanced Thermal Conductivity

Polymer-based composites with high thermal conductivity have great potential application as thermal management materials. This study was devoted to improving the thermal conductivity of the flexible thermoplastic polyurethane (TPU) by employing boron nitride (BN) as heat filler. We prepared flexible and thermally conductive TPU/BN composite via solution mixing and hot pressing. The thermal conductivity of the TPU/BN composite with 50 wt% BN (32.6 vol%) reaches 3.06 W/m·K, approximately 1290% enhancement compared to that of pure TPU (0.22 W/m·K). In addition, the thermal conductivity of our flexible TPU/BN composite with 30 wt% BN is almost not varied (a decrease of only 2.5%) after 100 cycles of mechanical bending, which indicates the high stability of heat conduction of our flexible TPU/BN composite under mechanical bending. The maximum tensile strength of the TPU/BN composite with 5 wt% BN is 48.9 MPa, 14% higher than that of pure TPU (43.2 MPa). Our flexible and highly thermally conductive TPU/BN composites show promise for heat dissipation in various applications in the electronics field.

Thermally Conductive Plastics for Enhanced Thermal Management

2015 ◽  
Vol 2015 (1) ◽  
pp. 000530-000535
Author(s):  
Chandrashekar Raman
Keyword(s):  
Thermal Conductivity ◽  
Natural Convection ◽  
Thermal Management ◽  
Electronic Devices ◽  
Heat Sinks ◽  
Significant Challenge ◽  
Design Engineers ◽  
Thermally Conductive ◽  
New Material ◽  
Conductive Plastics

Electronic devices continue to shrink while continuing to offer increasing functionality. This trend poses a significant challenge to design engineers who need to adequately address the increasing thermal management requirements of these devices on a shrinking footprint. Thermally conductive plastics have been gaining attention as an innovative new material option to address this challenge. While plastics are typically poor conductors of heat, it is possible to increase the thermal conductivity with the use of certain additives. Unique ceramic additives like boron nitride offer the added advantage of enabling thermally conductive plastic formulations that are also electrically insulating. The replacement of aluminum heat sinks in free (natural) convection environments with thermally conductive plastics is discussed in this paper. The results show it may indeed be possible to replace aluminum with thermally conductive plastic heat sinks in convection limited environments, and if judicious redesign of the plastic heat sink is incorporated, an improved thermal management solution can be realized. Additionally, the benefits of enhancing existing plastic housings to enable an improved thermal management solution are discussed. The results also show that modest enhancements to the thermal conductivity of existing plastic housings can yield significant improvements to the overall thermal management solution as well.

Sign in / Sign up

Export Citation Format

Share Document