Dispensing of Abrasive Thermal Pastes and Adhesives

2021 ◽  
Vol 18 (3) ◽  
pp. 24-25
Author(s):  
Keyword(s):  
Thermal Pastes

Thermal Performance of Different Carbonaceous Nanoparticles as Additives to Thermal Paste as an Interface Material

2021 ◽  
Author(s):  
Bharath Bharadwaj ◽  
Prashant Singh ◽  
Roop L. Mahajan
Keyword(s):  
Thermal Performance ◽  
Heat Dissipation ◽  
High Conductivity ◽  
The Other ◽  
Multilayer Graphene ◽  
Optimum Level ◽  
Thermal Paste ◽  
Nano Additives ◽  
Thermal Pastes ◽  
Interface Materials

Abstract With increased focus on miniature high power density electronic packages, there is a need for the development of new interface materials with lower thermal resistance. To this end, high conductivity thermal paste or similar thermal interface materials (TIMs), reinforced with superior thermal conductivity materials such as multi-walled carbon nanotubes (MWCNTs), graphene nanoplatelets (GNPs), graphite-derived multilayer graphene (g-MLG) offer an effective strategy to provide efficient paths for heat dissipation from heat source to heat sink. In an earlier paper, we had demonstrated that multilayer graphene derived from coal (coal-MLG) synthesized using our in-house developed one-pot process, has increased presence of phenolic groups on its surfaces, which translates into better dispersion of coal-MLG in silicone thermal paste. In this paper, we first compare the thermal conductance of a high conductivity thermal paste (k = 8.9 W/mK) using coal-MLG as an additive with that realized with other nano additives — MWCNTs, GNPs, and g-MLG. The data shows that coal-MLG as an additive outperforms all the other investigated nano additives in enhancing the thermal performance of the paste. With the coal-MLG as an additive, ∼70% increase in thermal performance was observed as compared to the base thermal paste used. This increase is about 2.5 times higher than that obtained using g-MLG as an additive. We also measured the thermal performance of coal-MLG-based TIM with its different wt.% fractions. The data confirmed our hypothesis that the optimum level of the loading fraction of the additive that can be dispersed in the matrix (paste in this case) before the onset of agglomeration is higher for the coal-MLG (3%) than for the other additives (2%). The implication is further improvement thermal performance with coal-MLG. The data shows the additional thermal enhancement to ∼2X. Finally, since coal-MLG produced by our in-house process is relatively cheaper and more environmentally friendly, we believe that these results would pave the path for enhanced thermal performance with non-silicone thermal pastes at a significantly lower cost. We also expect similar benefits for the silicone-based thermal pastes.

Rheological Behavior and Thermal Conductivities of Emulsion-Based Thermal Pastes

2020 ◽  
Vol 49 (3) ◽  
pp. 2100-2109
Author(s):  
Ali Yazdan ◽  
Jizhe Wang ◽  
Ce-Wen Nan ◽  
Liangliang Li
Keyword(s):  
Rheological Behavior ◽  
Thermal Pastes ◽  
Thermal Conductivities

Carbon Nanotube Thermal Pastes for Improving Thermal Contacts

2007 ◽  
Vol 36 (9) ◽  
pp. 1181-1187 ◽  
Author(s):  
Yunsheng Xu ◽  
Chia-Ken Leong ◽  
D.D.L. Chung
Keyword(s):  
Carbon Nanotube ◽  
Thermal Pastes ◽  
Thermal Contacts

Power Cycling Effects on the Structural Stability of Thermal Pastes Used in Microelectronics

2006 ◽  
Vol 977 ◽  
Author(s):  
Ijeoma Nnebe ◽  
Claudius Feger ◽  
Maurice McGlashan-Powell
Keyword(s):  
Structural Changes ◽  
Volume Fraction ◽  
Heat Spreader ◽  
Thermal Paste ◽  
Normal Forces ◽  
Power Cycling ◽  
Microelectronics Industry ◽  
Thermal Pastes ◽  
Filled Composite ◽  
Soft Composite

AbstractThermal pastes are a class of soft composite materials of great importance to the microelectronics industry. The function of these pastes is two-fold: (i) to transport heat away from the chip; and (ii) to accommodate mechanical stresses in the package arising from the mismatch in the thermal expansion between the chip and the heat spreader or sink. Due to the former requirement, thermal pastes are among some of the most highly-filled composite systems in practice (solids volume fraction > 70%). These materials are expected to withstand the significant normal forces, lateral forces, and temperature variations associated with chip operations and power off/on transitions. The structural changes and degradation of various thermal pastes during power cycling have been characterized using optical microscopy and IR thermography. Correlations between the evolving structures and variables such as thermal paste inhomogeneity and binder-particle dispersability have been successfully made and will be presented.

Electrically Nonconductive Thermal Pastes with Carbon as the Thermally Conductive Component

2007 ◽  
Vol 36 (6) ◽  
pp. 659-668 ◽  
Author(s):  
Chuangang Lin ◽  
Timothy A. Howe ◽  
D.D.L. Chung
Keyword(s):  
Thermally Conductive ◽  
Conductive Component ◽  
Thermal Pastes

Mixing, rheology, and stability of highly filled thermal pastes

2005 ◽  
Vol 49 (4.5) ◽  
pp. 699-707 ◽  
Author(s):  
C. Feger ◽  
J. D. Gelorme ◽  
M. McGlashan-Powell ◽  
D. M. Kalyon
Keyword(s):  
Thermal Pastes

Carbon-black thixotropic thermal pastes for improving thermal contacts

2005 ◽  
Vol 34 (10) ◽  
pp. 1336-1341 ◽  
Author(s):  
Chia-Ken Leong ◽  
Yasuhiro Aoyagi ◽  
D. D. L. Chung
Keyword(s):  
Carbon Black ◽  
Thermal Pastes ◽  
Thermal Contacts
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