Lifetime Estimation of Dry Starting Clutches

2021 ◽  
Vol 14 (2) ◽  
pp. 28-31
Author(s):  
René Knoblich ◽  
Jörg Beilharz ◽  
Clemens Gühmann
Keyword(s):  
Electronics ◽  
2021 ◽  
Vol 10 (3) ◽  
pp. 324
Author(s):  
Carmelo Barbagallo ◽  
Santi Agatino Rizzo ◽  
Giacomo Scelba ◽  
Giuseppe Scarcella ◽  
Mario Cacciato

This work presents a step-by-step procedure to estimate the lifetime of discrete SiC power MOSFETs equipping three-phase inverters of electric drives. The stress of each power device when it is subjected to thermal jumps from a few degrees up to about 80 °C was analyzed, starting from the computation of the average power losses and the commitment of the electric drive. A customizable mission profile was considered where, by accounting the working conditions of the drive, the corresponding average power losses and junction temperatures of the SiC MOSFETs composing the inverter can be computed. The tool exploits the Coffin–Manson theory, rainflow counting, and Miner’s rule for the lifetime estimation of the semiconductor power devices. Different operating scenarios were investigated, underlying their impact on the lifetime of SiC MOSFETs devices. The lifetime estimation procedure was realized with the main goal of keeping limited computational efforts, while providing an effective evaluation of the thermal effects. The method enables us to set up any generic mission profile from the electric drive model. This gives us the possibility to compare several operating scenario of the drive and predict the worse operating conditions for power devices. Finally, although the lifetime estimation tool was applied to SiC power MOSFET devices for a general-purpose application, it can be extended to any type of power switch technology.


2014 ◽  
Vol 61 (9) ◽  
pp. 4895-4902 ◽  
Author(s):  
Paul Kreczanik ◽  
Pascal Venet ◽  
Alaa Hijazi ◽  
Guy Clerc
Keyword(s):  

2016 ◽  
Vol 63 (12) ◽  
pp. 4852-4859 ◽  
Author(s):  
Ronaldo Antonio Guisso ◽  
Matheus Farencena Righi ◽  
Edilson Mineiro Sa ◽  
Rafael Adaime Pinto ◽  
Vitor Cristiano Bender ◽  
...  

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Leonid Anatolevich Olenev ◽  
Rafina Rafkatovna Zakieva ◽  
Nina Nikolaevna Smirnova ◽  
Rustem Adamovich Shichiyakh ◽  
Kirill Aleksandrovich Ershov ◽  
...  

Purpose This study aims to present a more accurate lifetime prediction model considering solder chemical composition. Design/methodology/approach Thermal cycling and standard creep tests as well as finite element simulation were used. Findings The study found lower error in the solder joint lifetime evaluation. The higher the Ag content is, the higher the lifetime is achieved. Originality/value It is confirmed.


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