Accurate composition dependent thermo mechanical lifetime estimation of hour glass type solder joint in electronic assemblies
2021 ◽
Vol ahead-of-print
(ahead-of-print)
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Keyword(s):
Purpose This study aims to present a more accurate lifetime prediction model considering solder chemical composition. Design/methodology/approach Thermal cycling and standard creep tests as well as finite element simulation were used. Findings The study found lower error in the solder joint lifetime evaluation. The higher the Ag content is, the higher the lifetime is achieved. Originality/value It is confirmed.
2021 ◽
Vol ahead-of-print
(ahead-of-print)
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2020 ◽
Vol ahead-of-print
(ahead-of-print)
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2020 ◽
Vol 39
(5)
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pp. 1145-1156
Keyword(s):
2020 ◽
Vol 39
(5)
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pp. 1085-1097
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2020 ◽
Vol ahead-of-print
(ahead-of-print)
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1992 ◽
Vol 114
(4)
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pp. 472-476
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Keyword(s):
2016 ◽
Vol 68
(2)
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pp. 250-258
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2005 ◽
Vol 297-300
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pp. 96-101
2014 ◽
Vol 33
(4)
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pp. 1145-1160
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2017 ◽
Vol 69
(1)
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pp. 71-80
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Keyword(s):