scholarly journals A review of passivity breakdown on metal surfaces: influence of chloride- and sulfide-ion concentrations, temperature, and pH

Author(s):  
Hemalatha Parangusan ◽  
Jolly Bhadra ◽  
Noora Al-Thani

AbstractMetals, including austenitic steels and alloys, have been extensively applied in industrial and engineering applications. Passive films on metal surfaces are very important for corrosion protection. However, localized attack, such as passive film breakdown and the initiation of pits, is found upon exposure of such metals to aggressive ion-containing environments, leading to material failure and prominent adverse economic and safety concerns. For several decades, the mechanism of passivity breakdown and pit nucleation during pitting corrosion has been widely studied. The present article provides a detailed review of passive film breakdown on metal surfaces and the effects of complicated conditions, such as chloride- and sulfide-ion concentrations, temperature, and solution pH, on passivity breakdown. The possible mechanism for passivity breakdown is reviewed and discussed. The composition, structure, and electronic properties of passive layers are of conclusive importance to understand the leading corrosion mechanism, and they have been investigated with different techniques. Furthermore, we aim to present the structure, chemical composition, and electronic properties of passive films on metal surfaces by using X-ray photoelectron spectroscopy and energy-dispersive spectroscopy. Additionally, the surface morphology of passive films is analyzed by scanning electron microscopy (SEM), transmission electron microscopy (TEM), and atomic force microscopy (AFM) techniques. Finally, the effect of chloride- and sulfide-ion concentrations, pH, and temperature on passivity breakdown is discussed in detail.

Author(s):  
Dongmei Meng ◽  
Laura Buck ◽  
James Cargo

Abstract Cu needs a higher level of ultrasound combined with bonding force to be bonded to the Al pad properly, not just because Cu is harder than Au, but it is also harder to initiate intermetallic compounds (IMC) formation during bonding. This increases the chances of damaging the metal/low k stack under the bondpad. This paper presents a fundamental study of IMC as well as one example of a failure mode of Cu/Al bonded devices, all based on detailed analysis using scanning electron microscopy, scanning transmission electron microscopy, energy dispersive spectrometers, and transmission electron microscopy. It presents a case study showing a corrosion mechanism of Cu/Al ballbond after 168hr UHAST stress. It is observed that all Cu9Al4 was consumed, while very little copper aluminide remained after 168 hours of UHAST stressing.


2017 ◽  
Vol 23 (S1) ◽  
pp. 1504-1505
Author(s):  
Taisuke Ohta ◽  
Morgann Berg ◽  
Kunttal Keyshar ◽  
Jason M. Kephart ◽  
Thomas E. Beechem ◽  
...  

CORROSION ◽  
1992 ◽  
Vol 48 (3) ◽  
pp. 229-238 ◽  
Author(s):  
M. J. Kloppers ◽  
F. Bellucci ◽  
R. M. Latanision

Metals ◽  
2021 ◽  
Vol 11 (1) ◽  
pp. 135
Author(s):  
Kathleen Jaffré ◽  
Benoît Ter-Ovanessian ◽  
Hiroshi Abe ◽  
Nicolas Mary ◽  
Bernard Normand ◽  
...  

The effect of dry grinding on 304L stainless steel’s passive behavior is compared to two other surface finishing (mechanical polishing down to 2400 with SiC emery paper and 1 µm with diamond paste, respectively). The characterization of the surface state was performed using scanning electron microscopy, transmission electron microscopy, 3D optical profilometer, and X-ray diffraction. Results indicate that each surface treatment leads to different surface states. The ground specimens present an ultrafine grain layer and a strong plastic deformation underneath the surface, while an ultrafine grain layer characterizes the subsurface of the polished specimens. Grinding induces high residual compressive stresses and high roughness compared to polishing. The characterization of the passive films was performed by electrochemical impedance spectroscopy and Mott–Schottky analysis. The study shows that the semiconductor properties and the thickness of the passive films are dependent on the surface state of the 304L stainless steel.


1995 ◽  
Vol 142 (10) ◽  
pp. 3336-3342 ◽  
Author(s):  
P. Schmuki ◽  
M. Büchler ◽  
S. Virtanen ◽  
H. Böhni ◽  
R. Müller ◽  
...  

1973 ◽  
Author(s):  
R. E. Watson ◽  
P. Fulde ◽  
A. Luther ◽  
Hugh C. Wolfe ◽  
C. D. Graham ◽  
...  

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