On the relationship between grain boundary sliding and crystal deformation

1969 ◽  
Vol 3 (4) ◽  
pp. 253-257 ◽  
Author(s):  
C.A.P Horton
1990 ◽  
Vol 5 (9) ◽  
pp. 2004-2022 ◽  
Author(s):  
John L. Walter ◽  
Clyde L. Briant

Tungsten wire for incandescent lamp filaments must operate at high temperatures and for long times. To meet these requirements, the grain morphology of the wire must be controlled to reduce the propensity for grain boundary sliding. The morphology is a function of the distribution of very small pockets of potassium in the wire and the mechanical processing from ingot to wire. The behavior of the filament is directly related to the grain morphology. This paper describes the mechanism by which the potassium is incorporated into and distributed in the ingot. The elongation and spheroidization of the bubbles during hot rolling and swaging are also examined and related to the grain morphology of wire. Some indications of the relationship between grain morphology and filament behavior are also given.


1999 ◽  
Vol 601 ◽  
Author(s):  
A. D. Sheikh-Ali ◽  
J. A. Szpunar ◽  
H. Garmestani

AbstractThis paper examines grain boundary sliding under the conditions of plastic strain incompatibility that is the most frequent case in polycrystalline materials. Two components of grain boundary sliding: dependent and independent on intragranular slip are distinguished. Theoretical estimate of a ratio between slip induced sliding and intragranular slip is obtained. It is concluded that slip and sliding are rather independent than interrelated processes.


Author(s):  
Nancy J. Tighe

Silicon nitride is one of the ceramic materials being considered for the components in gas turbine engines which will be exposed to temperatures of 1000 to 1400°C. Test specimens from hot-pressed billets exhibit flexural strengths of approximately 50 MN/m2 at 1000°C. However, the strength degrades rapidly to less than 20 MN/m2 at 1400°C. The strength degradition is attributed to subcritical crack growth phenomena evidenced by a stress rate dependence of the flexural strength and the stress intensity factor. This phenomena is termed slow crack growth and is associated with the onset of plastic deformation at the crack tip. Lange attributed the subcritical crack growth tb a glassy silicate grain boundary phase which decreased in viscosity with increased temperature and permitted a form of grain boundary sliding to occur.


1983 ◽  
Vol 44 (C9) ◽  
pp. C9-759-C9-764
Author(s):  
E. Bonetti ◽  
A. Cavallini ◽  
E. Evangelista ◽  
P. Gondi

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