High temperature electronic conduction mechanisms in YBa2Cu4O8

Solid State Ionics ◽

10.1016/0167-2738(91)90060-o ◽

1991 ◽

Vol 49 ◽

pp. 3-7 ◽

Author(s):

B Hong

Keyword(s):

High Temperature ◽

Electronic Conduction ◽

Conduction Mechanisms ◽

High Temperature Electronic

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High-Temperature Electronic Materials

Automotive Engineering ◽

10.1201/9781420011906-14 ◽

2008 ◽

pp. 87-100

Keyword(s):

High Temperature ◽

Electronic Materials ◽

High Temperature Electronic

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The Development and Qualification of a DC-DC Converter for 225°C (437°F) Operating Temperature

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/hitec-bhunt-wa22 ◽

2010 ◽

Vol 2010 (HITEC) ◽

pp. 000214-000221

Author(s):

Bob Hunt

Keyword(s):

High Temperature ◽

Operating Temperature ◽

Reliable Operation ◽

Packaging Technology ◽

High Temperature Electronic

This paper presents the development and qualification of high temperature electronic module packaging technology to service the requirements for extended and reliable operation at 225°C (437°F) for applications in the Oil & Gas, Automotive and Aerospace markets. It also covers the application of this technology to the first in a range of DC-DC converter modules and is based on Cissoid's ‘ETNA’ semiconductor components.

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Ultrasonic-assisted nano Ag-Al alloy sintering to enable high-temperature electronic interconnections

2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32862.2020.00311 ◽

2020 ◽

Author(s):

Canyu Liu ◽

Allan Liu ◽

Yi Zhong ◽

Stuart Robertson ◽

Zhaoxia Zhou ◽

...

Keyword(s):

High Temperature ◽

Al Alloy ◽

Ultrasonic Assisted ◽

High Temperature Electronic

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Ag–Sn Transient Liquid Phase Bonding for High Temperature Electronic Packaging: Effect of Ag Content

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2020.3009515 ◽

2020 ◽

Vol 10 (10) ◽

pp. 1604-1610

Author(s):

Nadeesh Singh Nobeen ◽

Guangxu Yan ◽

Chee Lip Gan ◽

Zhong Chen

Keyword(s):

High Temperature ◽

Liquid Phase ◽

Electronic Packaging ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

High Temperature Electronic ◽

Packaging Effect

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High-Temperature Electronic Requirements in Aeropropulsion Systems

IEEE Transactions on Industrial Electronics ◽

10.1109/tie.1982.356644 ◽

1982 ◽

Vol IE-29 (2) ◽

pp. 103-106 ◽

Author(s):

William C. Nieberding ◽

J. Anthony Powell

Keyword(s):

High Temperature ◽

High Temperature Electronic

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High-temperature electronic structure with the Korringa-Kohn-Rostoker Green's function method

Physical Review E ◽

10.1103/physreve.97.053205 ◽

2018 ◽

Vol 97 (5) ◽

Author(s):

C. E. Starrett

Keyword(s):

Electronic Structure ◽

High Temperature ◽

Green’S Function ◽

Green's Function ◽

Function Method ◽

Green’S Function Method ◽

High Temperature Electronic

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Electronic conduction mechanisms in thin amorphous semiconductor films

Thin Solid Films ◽

10.1016/0040-6090(76)90115-2 ◽

1976 ◽

Vol 34 (1) ◽

pp. 8 ◽

Author(s):

William Paul

Keyword(s):

Amorphous Semiconductor ◽

Electronic Conduction ◽

Semiconductor Films ◽

Conduction Mechanisms

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High temperature electronic for future hybrid powertrain application

2005 European Conference on Power Electronics and Applications ◽

10.1109/epe.2005.219769 ◽

2005 ◽

Author(s):

F. Renken ◽

R. Knorr

Keyword(s):

High Temperature ◽

Hybrid Powertrain ◽

High Temperature Electronic

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Enhanced High-Temperature Electronic Transport Properties in Nanostructured Epitaxial Thin Films of the Lan+1NinO3n+1Ruddlesden−Popper Series (n= 1, 2, 3, ∞)

Chemistry of Materials ◽

10.1021/cm070804e ◽

2007 ◽

Vol 19 (16) ◽

pp. 4056-4062 ◽

Author(s):

Mónica Burriel ◽

Gemma Garcia ◽

Marta D. Rossell ◽

Albert Figueras ◽

Gustaaf Van Tendeloo ◽

...

Keyword(s):

High Temperature ◽

Transport Properties ◽

Electronic Transport ◽

Epitaxial Thin Films ◽

Electronic Transport Properties ◽

High Temperature Electronic

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Thin film diamond devices for high temperature electronic applications: hydrogen doped structures

HITEN 99. Third European Conference on High Temperature Electronics. (IEEE Cat. No.99EX372) ◽

10.1109/hiten.1999.827496 ◽

2003 ◽

Author(s):

Hui Jin ◽

L.Y. Pang ◽

M.D. Whitfield ◽

R.B. Jackman

Keyword(s):

Thin Film ◽

High Temperature ◽

High Temperature Electronic

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