Modulation doping structures in silicon by molecular beam epitaxy and off-line ion implantation

1983 ◽  
Vol 1 (5-6) ◽  
pp. 157-162 ◽  
Author(s):  
T. De Jong ◽  
W.A.S. Douma ◽  
S. Doorn ◽  
F.W. Saris
2012 ◽  
Vol 5 (3) ◽  
pp. 035201 ◽  
Author(s):  
Giuliana Impellizzeri ◽  
Lucia Romano ◽  
Lorenzo Bosco ◽  
Corrado Spinella ◽  
Maria Grazia Grimaldi

2008 ◽  
Vol 51 (10) ◽  
pp. 1001-1015 ◽  
Author(s):  
A. V. Voitsekhovskii ◽  
D. V. Grigor’ev ◽  
N. Kh. Talipov

1996 ◽  
Vol 421 ◽  
Author(s):  
W.M. Chen ◽  
I.A. Buyanova ◽  
A. Buyanov ◽  
W.G. Bi ◽  
C.W. Tu

AbstractWe propose and demonstrate a new doping approach, i.e. intrinsic doping, for n-type modulation doping in InP-based heterostructures. Instead of the conventional method of n-type doping by shallow donor impurities, grown-in intrinsic defects are utilized to provide the required doping without external doping sources. The success of this approach is clearly demonstrated by our results from InGaAs/InP heterostructures, where the required n-type doping in the InP barriers is provided by Pin antisites, preferably introduced during off-stoichiometric growth of InP at low temperatures (LT-InP) by gas source molecular beam epitaxy. A twodimensional electron gas (2DEG) is shown to be formed near the InGaAs/InP heterointerface as a result of electron transfer from the LT-InP to the InGaAs active layer, from studies of Shubnikov-de Haas oscillations and photoluminescence. The concentration of the 2DEG is determined to be as high as 1.15×1012 cm−2, where two subbands of the 2DEG are readily occupied.


1988 ◽  
Vol 144 ◽  
Author(s):  
B.J. Skromme ◽  
N.G. Stoffel ◽  
A.S. Gozdz ◽  
M.C. Tamargo ◽  
S.M. Shibli

ABSTRACTWe describe the effects of rapid thermal annealing on the photoluminescence (PL) and electrical properties of heteroepitaxial ZnSe grown by molecular beam epitaxy on GaAs, using either no cap or plasma-deposited SiO2, Si3N4, or diamond-like C caps, and annealing temperatures from 500 to 800°C. Capless anneals (in contact with GaAs) produce badly degraded PL properties, while capped anneals can prevent this degradation. We show that Si3N4 is significantly more effective in preventing Zn out-diffusion through t e cap than previously employed SiO2 films, as evidenced by less pronounced PL features related to the creation of Zn vacancies during the anneal. Implant damage tends to enhance the Zn vacancy formation. Rapid thermal annealing with Si3N4 caps is shown to optically activate shallow N acceptor implants.


1995 ◽  
Vol 77 (8) ◽  
pp. 3919-3926 ◽  
Author(s):  
D. W. Elsaesser ◽  
Y. K. Yeo ◽  
R. L. Hengehold ◽  
K. R. Evans ◽  
F. L. Pedrotti

1986 ◽  
Vol 49 (18) ◽  
pp. 1184-1186 ◽  
Author(s):  
Yunosuke Makita ◽  
Yoshinori Takeuchi ◽  
Nobukazu Ohnishi ◽  
Toshio Nomura ◽  
Kazuhiro Kudo ◽  
...  

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