Electronic circuitry for a smart spinning-current Hall plate with low offset

1991 ◽  
Vol 27 (1-3) ◽  
pp. 747-751 ◽  
Author(s):  
P.J.A. Munter
Keyword(s):  
Electronic Circuitry ◽  
Low Offset ◽  
Hall Plate

A low-offset spinning-current hall plate

1990 ◽  
Vol 22 (1-3) ◽  
pp. 743-746 ◽  
Author(s):  
P.J.A. Munter
Keyword(s):  
Low Offset ◽  
Hall Plate

A CALIBRATED MODEL SEISMIC SYSTEM

Geophysics ◽  
1972 ◽  
Vol 37 (3) ◽  
pp. 445-455 ◽  
Author(s):  
C. N. G. Dampney ◽  
B. B. Mohanty ◽  
G. F. West
Keyword(s):  
Wave Propagation ◽  
Elastic Wave ◽  
Elastic Waves ◽  
Critical Examination ◽  
Two Dimensional ◽  
Linear Filtering ◽  
Analog Model ◽  
Basic Assumptions ◽  
Electronic Circuitry ◽  
Seismic System

Simple electronic circuitry and axially polarized ceramic transducers are employed to generate and detect elastic waves in a two‐dimensional analog model. The absence of reverberation and the basic simplicity. of construction underlie the advantages of this system. If the form of the fundamental wavelet in the model itself, as modified by the linear filtering effects of the remainder of the system, can be found, then calibration is achieved. This permits direct comparison of theoretical and experimental seismograms for a given model if its impulse response is known. A technique is developed for calibration and verified by comparing Lamb’s theoretical and experimental seismograms for elastic wave propagation over the edge of a half plate. This comparison also allows a critical examination of the basic assumptions inherent in a model seismic system.

A Low-noise Low-offset Op Amp in 0.35μm CMOS Process

2006 ◽  
Author(s):  
Zhineng Zhu ◽  
R. Tumati ◽  
S. Collins ◽  
R. Smith ◽  
D.E. Kotecki
Keyword(s):  
Low Noise ◽  
Cmos Process ◽  
Op Amp ◽  
Low Offset

scholarly journals Enabling internal electronic circuitry within additively manufactured metal structures – the effect and importance of inter-laminar topography

2018 ◽  
Vol 24 (1) ◽  
pp. 204-213
Author(s):  
Ji Li ◽  
Tom Monaghan ◽  
Robert Kay ◽  
Ross James Friel ◽  
Russell Harris
Keyword(s):  
Ion Beam ◽  
Content Type ◽  
Metal Structures ◽  
Ultrasonic Additive Manufacturing ◽  
Direct Printing ◽  
Electronic Circuitry ◽  
Dual Beam ◽  
Focussed Ion Beam ◽  
Scanning Electron Microscope Investigation ◽  
Electrical Materials

Purpose This paper aims to explore the potential of ultrasonic additive manufacturing (UAM) to incorporate the direct printing of electrical materials and arrangements (conductors and insulators) at the interlaminar interface of parts during manufacture to allow the integration of functional and optimal electrical circuitries inside dense metallic objects without detrimental effect on the overall mechanical integrity. This holds promise to release transformative device functionality and applications of smart metallic devices and products. Design/methodology/approach To ensure the proper electrical insulation between the printed conductors and metal matrices, an insulation layer with sufficient thickness is required to accommodate the rough interlaminar surface which is inherent to the UAM process. This in turn increases the total thickness of printed circuitries and thereby adversely affects the integrity of the UAM part. A specific solution is proposed to optimise the rough interlaminar surface through deforming the UAM substrates via sonotrode rolling or UAM processing. Findings The surface roughness (Sa) could be reduced from 4.5 to 4.1 µm by sonotrode rolling and from 4.5 to 0.8 µm by ultrasonic deformation. Peel testing demonstrated that sonotrode-rolled substrates could maintain their mechanical strength, while the performance of UAM-deformed substrates degraded under same welding conditions ( approximately 12 per cent reduction compared with undeformed substrates). This was attributed to the work hardening of deformation process which was identified via dual-beam focussed ion beam–scanning electron microscope investigation. Originality/value The sonotrode rolling was identified as a viable methodology in allowing printed electrical circuitries in UAM. It enabled a decrease in the thickness of printed electrical circuitries by ca. 25 per cent.

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