Incremental recrystallization/grain growth driven by elastic strain energy release in a thermomechanically fatigued lead-free solder joint

2007 ◽  
Vol 55 (7) ◽  
pp. 2265-2277 ◽  
Author(s):  
A.U. Telang ◽  
T.R. Bieler ◽  
A. Zamiri ◽  
F. Pourboghrat
Energies ◽  
2019 ◽  
Vol 12 (19) ◽  
pp. 3734
Author(s):  
Zhiguo LU ◽  
Wenjun JU ◽  
Fuqiang GAO ◽  
Youliang FENG ◽  
Zhuoyue SUN ◽  
...  

Because both faults and cleats exist in coal, sharp stress drops occur during loading when coal is deformed. These drops occur during the pre-peak stage and are accompanied by sudden energy releases. After a stress drop, the stress climbs slowly following a zigzag path and the energy accumulated during the pre-peak stage is unstable. A stress–strain curve is the basic tool used to evaluate the bursting liability of coal. Based on energy accumulation in an unsteady state, the pre-peak stress–strain curve is divided into three stages: pre-extreme, stress drop, and re-rising stage. The energy evolution of the specimen during each stage is analyzed. In this paper, an index called the effective elastic strain energy release rate (EESERR) index is proposed and used to evaluate the coal’s bursting liability. The paper shows that the propagation and coalescence of cracks is accompanied by energy release. The stress climb following a zigzag path prolongs the plastic deformation stage. This causes a significant difference between the work done by a hydraulic press during a laboratory uniaxial compression experiment and the elastic strain energy stored in the specimen during the experiment, so the evaluation result of the burst energy index would be too high. The determination of bursting liability is a comprehensive evaluation of the elastic strain energy accumulated in coal that is released when the specimen is damaged. The index proposed in this paper fully integrates the energy evolution of coal samples being damaged by loading, the amount of elastic strain energy released during the sample failure divided by the failure time is the energy release rate. The calculation method is simplified so that the uniaxial compressive strength and elastic modulus are included which makes the new index more universal and comprehensive. Theoretical analysis and physical compression experiments validate the reliability of the evaluation.


2012 ◽  
Vol 38 ◽  
pp. 265-277 ◽  
Author(s):  
Timothy R.H. Davies ◽  
Mauri J. McSaveney ◽  
Carolyn J. Boulton

2009 ◽  
Vol 517 (14) ◽  
pp. 4255-4259 ◽  
Author(s):  
Jong-Min Kim ◽  
Seung-Wan Woo ◽  
Yoon-Suk Chang ◽  
Young-Jin Kim ◽  
Jae-Boong Choi ◽  
...  

2016 ◽  
Vol 46 (3) ◽  
pp. 1674-1682 ◽  
Author(s):  
Yan Li ◽  
Olen Hatch ◽  
Pilin Liu ◽  
Deepak Goyal

Author(s):  
Kanji Takagi ◽  
Masaki Wakabayashi ◽  
Junichi Inoue ◽  
Qiang Yu ◽  
Takahiro Akutsu

This paper proposes the high reliable design method for lead-free solder joint on metal substrate on chip component. First, the crack propagation analysis method for estimating rupture life of solder joint was constructed. And then, the effect of material properties of insulating layer on metal substrate and solder joint shape for rupture life of solder joint was evaluated using crack propagation analysis. As the result, the relation between young’s modulus of insulating layer and rupture life was indicated quantitatively. Also, the relation of filet length for rupture life of solder joint was evaluated. Secondary, evaluation method of heat dissipation for metal substrate was proposed. Because thermal conductivity of insulating layer affects temperature rise of heating device. And, the relation between thermal conductivity of insulating layer and temperature rise of heating device was indicated.


2007 ◽  
Vol 345-346 ◽  
pp. 1393-1396
Author(s):  
Ouk Sub Lee ◽  
Man Jae Hur ◽  
Yeon Chang Park ◽  
Dong Hyeok Kim

It is well-known that the vibration significantly affect the life of solder joint. In this paper, the effects of the vibration on the failure probability of the solder joint are studied by using the failure probability models such as the First Order Reliability Method (FORM) and the Second Order Reliability Method (SORM). The accuracies of the results are estimated by a help of the Monte Carlo Simulation (MCS). The reliability of the lead and the lead-free solder joint was also evaluated. The reliability of lead-free solder joint is found to be higher than that of lead solder joint.


2015 ◽  
Vol 830-831 ◽  
pp. 265-269
Author(s):  
Satyanarayan ◽  
K.N. Prabhu

In the present work, the bond strength of Sn-0.7Cu, Sn-0.3Ag-0.7Cu, Sn-2.5Ag-0.5Cu and Sn-3Ag-0.5Cu lead free solders solidified on Cu substrates was experimentally determined. The bond shear test was used to assess the integrity of Sn–Cu and Sn–Ag–Cu lead-free solder alloy drops solidified on smooth and rough Cu substrate surfaces. The increase in the surface roughness of Cu substrates improved the wettability of solders. The wettability was not affected by the Ag content of solders. Solder bonds on smooth surfaces yielded higher shear strength compared to rough surfaces. Fractured surfaces revealed the occurrence of ductile mode of failure on smooth Cu surfaces and a transition ridge on rough Cu surfaces. Though rough Cu substrate improved the wettability of solder alloys, solder bonds were sheared at a lower force leading to decreased shear energy density compared to the smooth Cu surface. A smooth surface finish and the presence of minor amounts of Ag in the alloy improved the integrity of the solder joint. Smoother surface is preferable as it favors failure in the solder matrix.


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