Strengthening gold thin films with zirconia nanoparticles for MEMS electrical contacts

2008 ◽  
Vol 56 (8) ◽  
pp. 1813-1819 ◽  
Author(s):  
Jesse R. Williams ◽  
David R. Clarke
Keyword(s):  
Thin Films ◽  
Electrical Contacts ◽  
Gold Thin Films ◽  
Zirconia Nanoparticles

scholarly journals Wetting behavior and interfacial characteristic of eutectic In-Ag solders on Au thin films

2018 ◽  
Vol 16 (3) ◽  
Author(s):  
Muhammad Mansoor Mansoor ◽  
Ahnaf Usman Zilohu ◽  
Muhammad Mujahid ◽  
Shaheed Khan
Keyword(s):  
Thin Films ◽  
Electrical Contacts ◽  
Spreading Factor ◽  
Soldering Temperature ◽  
Indium Alloys ◽  
The Common ◽  
Gold Thin Films ◽  
Au Thin Films ◽  
Interfacial Characteristic ◽  
Soldering Alloys

Soldering electrical contacts to gold thin films is a matter of consideration due to high soldering temperature, restricted wetting, excessive scavenging and low strength offered by most of the common soldering alloys. Indium alloys offer certain benefits for gold soldering justifying their increased cost. In the present study, hypo-, hyper- and eutectic In-Ag solder were prepared and investigated for compositional and structural homogeneity, soldering temperature, contact angle, spreading factor, scavenging zone and scavenging phase (i.e. AuIn2). It was found that addition of silver (~3.5%) ameliorated the above mentioned characteristics for better control of soldering practice with gold thin films besides lowering the soldering temperature.

scholarly journals Wetting behavior and interfacial characteristic of eutectic In-Ag solders on Au thin films

2019 ◽  
Vol 16 (3) ◽  
Author(s):  
Muhammad Mansoor Mansoor ◽  
Ahnaf Usman Zilohu ◽  
Muhammad Mujahid ◽  
Shaheed Khan
Keyword(s):  
Thin Films ◽  
Electrical Contacts ◽  
Spreading Factor ◽  
Soldering Temperature ◽  
Indium Alloys ◽  
The Common ◽  
Gold Thin Films ◽  
Au Thin Films ◽  
Interfacial Characteristic ◽  
Soldering Alloys

Soldering electrical contacts to gold thin films is a matter of consideration due to high soldering temperature, restricted wetting, excessive scavenging and low strength offered by most of the common soldering alloys. Indium alloys offer certain benefits for gold soldering justifying their increased cost. In the present study, hypo-, hyper- and eutectic In-Ag solder were prepared and investigated for compositional and structural homogeneity, soldering temperature, contact angle, spreading factor, scavenging zone and scavenging phase (i.e. AuIn2). It was found that addition of silver (~3.5%) ameliorated the above mentioned characteristics for better control of soldering practice with gold thin films besides lowering the soldering temperature.

Extended cyclic uniaxial loading of stretchable gold thin-films on elastomeric substrates

2009 ◽  
Vol 94 (7) ◽  
pp. 071902 ◽  
Author(s):  
Ingrid M. Graz ◽  
Darryl P. J. Cotton ◽  
Stéphanie P. Lacour
Keyword(s):  
Thin Films ◽  
Uniaxial Loading ◽  
Gold Thin Films

Localized Physical Vapor Deposition via Focused Laser Spike Dewetting of Gold Thin Films for Nanoscale Patterning

2018 ◽  
Vol 2 (1) ◽  
pp. 586-597 ◽  
Author(s):  
Tianxing Ma ◽  
Michael P. Nitzsche ◽  
Arielle R. Gamboa ◽  
Valeria Saro-Cortes ◽  
Jonathan P. Singer
Keyword(s):  
Thin Films ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Nanoscale Patterning ◽  
Gold Thin Films

Mechanisms of Grain Growth in Free-Standing Nanograined Gold Thin Films

2005 ◽  
Vol 907 ◽  
Author(s):  
J. A. Gregg ◽  
K Hattar ◽  
C H Lei ◽  
I M Robertson
Keyword(s):  
Thin Films ◽  
Grain Growth ◽  
Structural Changes ◽  
Dislocation Slip ◽  
Free Standing ◽  
Transmission Electron ◽  
Enhanced Properties ◽  
Gold Thin Films ◽  
Annealing Experiments

AbstractRetention of the enhanced properties reported for nanograined metallic systems requires that the nanostructure be insensitive to temperature and deformation. In situ transmission electron microscopy annealing experiments were employed to investigate the structural changes associated with the formation of micron-sized grains in nanograined evaporated gold thin films. This abnormal grain growth occurs randomly throughout the film. Twinning but not dislocation slip occurs in the growing grains until the grain size is in the hundreds of nanometer range. The twins appear to hinder growth and for grain growth to continue the twins must either be annihilated or be able to grow with the grain concurrently.

Structural damage of Bacillus subtilis biofilms using pulsed laser interaction with gold thin films

2016 ◽  
Vol 10 (8) ◽  
pp. 1043-1052
Author(s):  
Judith Krawinkel ◽  
Maria Leilani Torres-Mapa ◽  
Eisha Mhatre ◽  
Ákos T. Kovács ◽  
Alexander Heisterkamp
Keyword(s):  
Thin Films ◽  
Bacillus Subtilis ◽  
Structural Damage ◽  
Pulsed Laser ◽  
Laser Interaction ◽  
Gold Thin Films
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