A Strategy to Mitigate Single Event Upset in 14 nm CMOS Bulk FinFET Technology

3D TCAD simulations demonstrated that reducing the distance between the well boundary and NMOS or PMOS can mitigate the cross section of Single Event Upset (SEU) in 14 nm CMOS bulk FinFET technology. The competition of charge collection between well boundary and sensitive nodes, the enhanced restore currents and the change of bipolar effect are responsible for the decrease of SEU cross section. Different from Dual-interlock cells (DICE) design, under the presence of enough taps to ensure the rapid recovery of well potential, this approach is more effective under heavy ion irradiation of higher LET. Besides, the feasibility of this method and its effectiveness with feature size scaling down are discussed.

Work Function Modulation of Few-Layer Graphene by Swift Heavy Ion Irradiation

Here, we report the structural and electronic modification induced in chemical vapor deposited graphene by using swift heavy ions (70 MeV Ni6+).Raman spectroscopy was used to quantify the irradiation-induced modification in vibrational properties. The increase in defect density with fluence causes an increase in the intensity ratio of its characteristic Raman D and G band. The increase in defect density also results in a decrease in crystallite size. The changes in the crystal structure are observed from X-rays diffraction measurement. Swift heavy ion irradiation induced defect, modified the surface roughness and surface potential of graphene thin film as measured from atomic force microscopy and scanning Kelvin probe microscopy respectively. The increase in the work function, surface roughness as well as defect concentration with fluence, indicate the possibility of linear correlation between them. Presence of defects in graphene sheets strongly affects surface electronic and optical properties of the material that can be used to tailor the optoelectronics device performance.