Local bond strength prediction of deformed reinforcing bars in concrete considering heterogeneity at interface regions

An analytical model is proposed to predict local bond strength (τf) by incorporating heterogeneity at interface regions for deformed reinforcing bars centrally anchored in concrete. The rib width on the bar surface is introduced as an interfacial characteristic parameter G in the proposed model; this accounts for the heterogeneity. Both τf and the local interfacial fracture energy (GIIf) of each specimen were found to be linked to G and can be determined analytically from the maximum pull-out loads (Fmax) from tests. It was found that the predicted τf was larger than the maximum average bond stress (τavg-max); the discrepancy between the two values reduced with an increase in L/G. Moreover, with an increase in L/G, the predicted τf showed a certain decrease, with the reduction decreasing with stronger interfacial homogeneity. The predicted GIIf was found to be significantly increased because of the weaker boundary effect. The validity of the proposed model was verified using comparisons of predicted Fmax (using the determined values of τf and GIIf) and the experimental Fmax, with the only failure mode being bar pull-out. Moreover, the model can be applied to steel or fibre-reinforced polymer bars and the concrete refers to all types of cementitious materials.

Wetting behavior and interfacial characteristic of eutectic In-Ag solders on Au thin films

Soldering electrical contacts to gold thin films is a matter of consideration due to high soldering temperature, restricted wetting, excessive scavenging and low strength offered by most of the common soldering alloys. Indium alloys offer certain benefits for gold soldering justifying their increased cost. In the present study, hypo-, hyper- and eutectic In-Ag solder were prepared and investigated for compositional and structural homogeneity, soldering temperature, contact angle, spreading factor, scavenging zone and scavenging phase (i.e. AuIn2). It was found that addition of silver (~3.5%) ameliorated the above mentioned characteristics for better control of soldering practice with gold thin films besides lowering the soldering temperature.

Wetting behavior and interfacial characteristic of eutectic In-Ag solders on Au thin films

Soldering electrical contacts to gold thin films is a matter of consideration due to high soldering temperature, restricted wetting, excessive scavenging and low strength offered by most of the common soldering alloys. Indium alloys offer certain benefits for gold soldering justifying their increased cost. In the present study, hypo-, hyper- and eutectic In-Ag solder were prepared and investigated for compositional and structural homogeneity, soldering temperature, contact angle, spreading factor, scavenging zone and scavenging phase (i.e. AuIn2). It was found that addition of silver (~3.5%) ameliorated the above mentioned characteristics for better control of soldering practice with gold thin films besides lowering the soldering temperature.