Thermal vacancy behavior analysis through thermal expansion, lattice parameter and elastic modulus measurements of B2-type FeAl

2014 ◽  
Vol 64 ◽  
pp. 382-390 ◽  
Author(s):  
Mi Zhao ◽  
Kyosuke Yoshimi ◽  
Kouichi Maruyama ◽  
Kunio Yubuta
Keyword(s):  
Thermal Expansion ◽  
Elastic Modulus ◽  
Behavior Analysis ◽  
Lattice Parameter ◽  
Thermal Vacancy

Measurement and interpretation of stress in copper films as a function of thermal history

1991 ◽  
Vol 6 (7) ◽  
pp. 1498-1501 ◽  
Author(s):  
Paul A. Flinn
Keyword(s):  
Mechanical Properties ◽  
Thermal Expansion ◽  
Elastic Modulus ◽  
Thermal History ◽  
Copper Films ◽  
Thermally Induced ◽  
Aluminum Films ◽  
Interconnection Material ◽  
Interconnect Systems

Since copper has some advantages relative to aluminum as an interconnection material, it is appropriate to investigate its mechanical properties in order to be prepared in advance for possible problems, such as the cracks and voids that have plagued aluminum interconnect systems. A model previously used to interpret the behavior of aluminum films proves to be, with minor modification, also applicable to copper. Although the thermal expansion of copper is closer to that of silicon and, consequently, the thermally induced strains are smaller, the much larger elastic modulus of copper results in substantially higher stresses. This has implications for the interaction of copper lines with dielectrics.

Hysteresis in thermal expansion of the quasi 1-dimensional conductor TaS3: Coupling of the underlying and the electronic crystals

2002 ◽  
Vol 12 (9) ◽  
pp. 287-287
Author(s):  
V. Ya. Pokrovskii ◽  
A. V. Golovnya ◽  
P. M. Shadrin
Keyword(s):  
Thermal Expansion ◽  
Elastic Modulus ◽  
Charge Density ◽  
Hysteresis Loop ◽  
Charge Density Waves ◽  
Small Sample ◽  
Temperature Hysteresis ◽  
Static Regime ◽  
Peierls Transition ◽  
Sample Elongation

An interferometer-based setup for measurements of length of needle-like samples is developed, and thermal expansion of o-TaS3 crystals is studied. Below the Peierls transition the temperature hysteresis of length L is observed, the width of the hysteresis loop $\delta L/L$ being up to $5\times 10^{-5}$. Curiously, $L(T)$ changes so that it is in front of its equilibrium value. The hysteresis loop couples with that of conductivity. With lowering T the charge-density waves' (CDW) elastic modulus grows and at 100 K becomes comparable with that of the lattice Yl. The results justify the assumption about the strain dependence of the CDW wave vector and clarify the nature of the anomalies of Yl which occur on the CDW depinning. In particular, Yl, is expected to show a strong drop in the static regime, if measured at sufficiently small sample elongation $(\delta L/L < 10^{ -5}) $.

Reduction in Wear Rate of α-Alumina and Silicon Nitride by Diffusional Surface Modification

1988 ◽  
Vol 140 ◽  
Author(s):  
A.K. Gangopadhyay ◽  
M.E. Fine ◽  
H.S. Cheng
Keyword(s):  
Wear Resistance ◽  
Thermal Expansion ◽  
Surface Modification ◽  
Silicon Nitride ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Surface Region ◽  
Lattice Parameter ◽  
Lower Thermal Expansion ◽  
Wear Modes

AbstractThe surface regions of α-alumina and hot pressed silicon nitride were modified by suitable alloying in order to improve their wear resistance. The surface modification in polycrystalline α-alumina was done by diffusing chromia into the surface region which resulted in the formation of a thin layer of A12O3 - Cr9O3 solid solution which has a lower thermal expansion coefficient than pure α-alumina. Also Cr2O3 has a larger lattice parameter than α-alumina thus during cooling the surface was put into compression. The surface region of hot pressed silicon nitride was modified by diffusing α-alumina into the surface which resulted in the formation of a thin sialon layer. A surface compressive stress was again introduced due to the lower thermal expansion coefficient and larger latticeparameter of sialon compared to silicon nitride.Wear tests were conducted against 52100 steel under both lubricated and unlubricated sliding contact using a block on ring apparatus. The wear resistance of chromia surface alloyed α-alumina was improved considerably over unalloyed α-alumina under both lubricated and unlubricated conditions. The wear resistance of alumina surface alloyed silicon nitride was also improved over unalloyed silicon nitride under both lubricated and unlubricated conditions.Different wear modes were identified by examining the worn surfaces under the scanning electron microscope.

scholarly journals Improving Mechanical, Thermal and Damping Properties of NiTi (Nitinol) Reinforced Aluminum Nanocomposites

2020 ◽  
Vol 4 (1) ◽  
pp. 19 ◽  
Author(s):  
Penchal Reddy Matli ◽  
Vyasaraj Manakari ◽  
Gururaj Parande ◽  
Manohar Reddy Mattli ◽  
Rana Abdul Shakoor ◽  
...  
Keyword(s):  
Tensile Strength ◽  
Thermal Expansion ◽  
Elastic Modulus ◽  
Yield Strength ◽  
Coefficient Of Thermal Expansion ◽  
Microwave Sintering ◽  
Hot Extrusion ◽  
Damping Capacity ◽  
Damping Properties ◽  
Niti Particle

In the present study, Ni50Ti50 (NiTi) particle reinforced aluminum nanocomposites were fabricated using microwave sintering and subsequently hot extrusion. The effect of NiTi (0, 0.5, 1.0, and 1.5 vol %) content on the microstructural, mechanical, thermal, and damping properties of the extruded Al-NiTi nanocomposites was studied. Compared to the unreinforced aluminum, hardness, ultimate compression/tensile strength and yield strength increased by 105%, 46%, 45%, and 41% while elongation and coefficient of thermal expansion (CTE) decreased by 49% and 22%, respectively. The fabricated Al-1.5 NiTi nanocomposite exhibited significantly higher damping capacity (3.23 × 10−4) and elastic modulus (78.48 ± 0.008 GPa) when compared to pure Al.

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